1.125Gb: x18, x36 RLDRAM 3 Features RLDRAM 3 MT44K64M18 4 Meg x 18 x 16 Banks MT44K32M36 2 Meg x 36 x 16 Banks 1 Options Marking Features t Clock cycle and RC timing 1200 MHz DDR operation (2400 Mb/s/ball data t 0.83ns and RC (MIN) = 6.67ns -083F rate) (RL3-2400) 86.4Gb/s peak bandwidth (x36 at 1200 MHz clock t 0.83ns and RC (MIN) = 7.5ns -083E frequency) (RL3-2400) Organization t 0.93ns and RC (MIN) = 7.5ns -093F 64 Meg x 18, and 32 Meg x 36 common I/O (CIO) (RL3-2133) 16 banks t 0.93ns and RC (MIN) = 8ns -093E 1.2V center-terminated push/pull I/O (RL3-2133) 2.5V V , 1.35V V , 1.2V V (optional 1.35V t EXT DD DDQ 1.07ns and RC (MIN) = 8ns -107E V for 2400 operation only). DDQ (RL3-1866) t Reduced cycle time ( RC (MIN) = 6.67 - 8ns) Configuration SDR addressing 64 Meg x 18 64M18 Programmable READ/WRITE latency (RL/WL) and 32 Meg x 36 32M36 burst length Operating temperature Data mask for WRITE commands Commercial (T = 0 to +95C) None C Differential input clocks (CK, CK ) Industrial (T = 40C to +95C) IT C Free-running differential input data clocks (DKx, Package DKx ) and output data clocks (QKx, QKx ) 168-ball BGA (Pb-free) RB On-die DLL generates CK edge-aligned data and Revision :A differential output data clock signals 1. Not all options listed can be combined to Note: 64ms refresh (128K refresh per 64ms) define an offered product. Use the part cat- 168-ball BGA package alog search on www.micron.com for availa- or 60 matched impedance outputs ble offerings. Integrated on-die termination (ODT) Single or multibank writes Extended operating range (2001200 MHz) READ training register Multiplexed and non-multiplexed addressing capa- bilities Mirror function Output driver and ODT calibration JTAG interface (IEEE 1149.1-2001) PDF: 09005aef85a88362 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 1.125Gb rldram3.pdf Rev. E 1/19 EN 2015 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.1.125Gb: x18, x36 RLDRAM 3 Features Figure 1: 1Gb RLDRAM 3 Part Numbers Example Part Number: MT44K32M36RB-093E:A -: MT44K Configuration Package Speed Temp Rev Revision Die Rev :A Configuration 64 Meg x 18 64M18 Temperature 32 Meg x 36 32M36 None Commercial IT Industrial Package Speed Grade 168-ball BGA (Pb-free) RB t t -083F CK = 0.83ns (6.67ns RC) t t -083E CK = 0.83ns (7.5ns RC) t t -093F CK = 0.93ns (7.5ns RC) t t -093E CK = 0.93ns (8ns RC) t t -107E CK = 1.07ns (8ns RC) BGA Part Marking Decoder Due to space limitations, BGA-packaged components have an abbreviated part marking that is different from the part number. Microns BGA Part Marking Decoder is available on Microns Web site at www.micron.com. PDF: 09005aef85a88362 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 1.125Gb rldram3.pdf Rev. E 1/19 EN 2015 Micron Technology, Inc. All rights reserved.