Freescale Semiconductor Document Number: MPXV6115V Data Sheet: Technical Data Rev. 4.0, 09/2015 MPXV6115V, -115 to 0 kPa, Gauge, MPXV6115V and Absolute Pressure Sensor The MPXV6115V series sensor integrates on-chip, bipolar op-amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration Small outline package make this pressure sensor a logical and economical choice for the system designer. The MPXV6115V series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXV6115V6U/6T1 MPXV6115VC6U Features Case 98ASB17756C Case 98ASB17757C Improved accuracy at high temperature 1.5% maximum error from 0 to 85 C Top view Ideally suited for microprocessor- or microcontroller-based systems Temperature compensated from -40 to +125 C Durable thermoplastic surface mount package DNC 5 4 V OUT DNC 6 3 GND Typical applications Vacuum pump monitoring DNC 7 2 V S Brake booster monitoring DNC 8 1 DNC Pin 1 identification, notch on first pin or chamfered corner. Pinout Ordering information of Ports Pressure Type Device Device name Shipping Package Marking None Single Dual Gauge Differential Absolute Small Outline Package Vacuum/ 98ASB17756C MPXV6115V6U Rail MPXV6115V Gauge Vacuum/ 98ASB17756C MPXV6115V6T1 Tape and Reel MPXV6115V Gauge Vacuum/ 98ASB17757C MPXV6115VC6U Rail MPXV6115V Gauge Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2009-2013, 2015 Freescale Semiconductor, Inc. All rights reserved.Contents 1 General Description 3 1.1 Block diagram . 3 1.2 Pinout . 3 2 Mechanical and Electrical Specifications . 4 2.1 Maximum ratings . 4 2.2 Operating characteristics 4 3 On-chip Temperature Compensation and Calibration 5 4 Package Information 7 4.1 Minimum recommended footprint for surface mounted applications . 7 4.2 Package Dimensions . 8 5 Revision History 10 Related Documentation The MPXV6115V device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: