HSSC427.xxx - 1206 High Stability Silicon Capacitor Rev 3.2 Key features Key applications n All demanding applications, such as n Ultra high stability : medical, aerospace, automotive industry w Temperature <0.5% (-55 C to +150 C) n High stability applications w Voltage <0.1 %/V n Decoupling / Filtering / Charge pump w Negligible aging <0.001% /1000hours (i.e.: Pacemakers / defibrillators) n Unique high capacitance in EIA/1206 package n Devices with battery operations size, up to 1 F n Replacement of X7R and NP0 n High reliability (FIT <0.017 parts / billion hours) n Downsizing n Low leakage current down to 100 pA n Low ESL and Low ESR n Suitable with lead free reflow-soldering *Please refer to our assembly Application Note for further recommendations Thanks to the unique IPDiA Silicon capacitor The IPDiA technology features a capacitor technology, most of the problems encountered in integration capability (up to 250nF/mm ) which demanding application can be solved. allows a smaller case size than existing solutions High Stability Silicon Capacitors are dedicated to to answer high volume constraints. This applications where Reliability is the main technology also offers high reliability, up to 10 parameter thanks to our end of production Burn- times better than alternative capacitor in. technologies, such as Tantalum or MLCC, and HSSC avoids the need to oversize the capacitor eliminates cracking phenomena. value for sensitive capacitive circuitry and offers a This Silicon based technology is RoHS compliant higher DC voltage stability. and compatible with lead free reflow soldering This technology provides industry leading process. performances relative to the capacitor stability over the full operating voltage & temperature range. The very high and stable insulation resistance of silicon capacitors can enhance up to 30 % the battery lifetime in mobile applications. HSSC427.xxx Electrical specification Capacitance value Parameters Value (***) Capacitance range 10 nF to 1F 10 15 22 33 47 68 (***) Capacitance tolerances 15 % 10nF Contact Contact Contact Contact Contact (**) 1 nF 935.131.427.510 IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales -55 C to 150 C Operating temperature range 100nF Contact Contact Contact Contact Contact Storage temperatures - 70 C to 165 C 10 nF 935.131.427.610 IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales Temperature coefficient <0.5 %, from -55 C to +150 C 1F (***) 0,1 F Breakdown voltage (BV) 11 VDC 935.131.427.710 Capacitance variation versus 0.1 % /V (from 0 V to RVDC) 1 F RVDC Equivalent Serial Inductor (ESL) Max 1nH (*) Thinner thickness (as low as 100 m thick) available, see Low Profile Silicon Capacitor product: LPSC (***) Equivalent Serial Resistor (ESR) Max 500mW 100GW min 3V, from (**) Extended temperature range (up to +250 C) available, see Xtreme Temperature Silicon Capacitor product: XTSC Insulation resistance -55C to +150C Ageing Negligible, < 0.001 % / 1000 h (***) Other values on request. FIT<0.017 parts / billion hours, Reliability (*) Capacitor height Max 400 m Temperature coefficient DC Voltage stability ESL (nH) 25C PICS vs. MLCC capacitors MLCC capacitors vs. PICS 0402 C0G(NPO) vs. PICS 20 10 1,1 PICS 10 0 1 PICS PICS C0G 0 -10 0,9 C0G C0G C0G -10 X8R X8R -20 0,8 X7R X7R -20 0,7 -30 Z5U X7R -30 -40 0,6 0,5 -40 -50 Y5V 0,4 -60 -50 Z5U Z5U 0,3 -70 -60 Temperature (C) 0,2 -80 Y5V -70 PICS Y5V Y5V 0,1 -90 -80 0 -50 0 50 100 150 200 -100 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 Temperature (C) 0 1 2 3 4 5 6 7 Temperature (C) Capacitance (pF) Bias voltage (V) Fig.1 Capacitance change versus temperature Fig.2 Capacitance change versus voltage Fig.3 ESL versus capacitance value variation compared with alternative dielectrics variation compared with alternative dielectrics compared with alternative dielectrics Part Number 935.131. B.2 S. U xx Value (E6) 10 Breakdown 15 Voltage 22 Size 4 = 11V Unit 33 i.e.: 1 F/1206 case (HSSC type) 7 = 1206 5 = 1 n 0 = 10 f 47 6 = 10 n 1 = 0.1 p 68 935.131.427.710 7 = 0.1 2 = 1 p 8 = 1 3 = 10 p 9 = 10 4 = 0.1 n Termination and Outline Termination Package outline Lead-free nickel/solder coating compatible L with automatic soldering technologies: Typ. 1206 W reflow and manual. L 3.360.05 Comp. Solder size Land IPD W 1.760.05 Resist component pattern Typical dimensions, all dimensions in mm. (1206 PCB footprint) Packaging Tape and reel, tray, waffle pack or wafer delivery. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information For more information, please visit: