HTSC424.xxx - 0402 High Temperature Silicon Capacitor Rev 3.1 Key features Key applications n All applications up to 200C, such as n High stability up to 200C: military, aerospace and automotive w Temperature <1% (-55 C to +200 C) industries w Voltage <0.1 %/V n High reliability applications w Negligible capacitance loss through aging n Replacement of X7R and C0G dielectrics n Unique high capacitance in EIA/0402 package n Decoupling / Filtering / Charge pump size, up to 47 nF (i.e.: motor management, temperature sensors) n High reliability (FIT <0.017 parts / billion hours) n Downsizing n Low leakage current down to 100 pA n Low ESL and Low ESR n Suitable for lead free reflow-soldering *Please refer to our assembly Application Note for further recommendations Thanks to the unique IPDiA Silicon capacitor The IPDiA technology offers industry leading technology, most of the problems encountered in performances relative to Failure rate with a demanding applications can be solved. FIT<0.017. High Temperature Silicon Capacitors are This technology also offers high reliability, up to dedicated to applications where reliability up to 10 times better than alternative capacitor 200C is the main parameter. technologies, such as Tantalum or MLCC, and This technology features a capacitor integration eliminates cracking phenomena. capability (up to 250nF/mm ) which offers This Silicon based technology is RoHS compliant capacitance value similar to X7R dielectric, but and compatible with lead free reflow soldering with better electrical performances than C0G/NP0 process. dielectrics, up to 200C. HTSC provides the highest capacitor stability over the full -55C/+200C temperature range in the market with a Temperature coefficient Lower than 1%. HTSC424.xxx Electrical specification Capacitance value Parameters Value (***) Capacitance range 100 pF to 100 nF 10 15 22 33 47 68 (***) Capacitance tolerances 15 % Contact Contact Contact Contact Contact Contact (**) 1 pF IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales -55 C to 200 C Operating temperature range 100 pF: 150 pF: 220 pF: 330 pF: 470 pF: 680 pF: Storage temperatures - 70 C to 215 C 10 pF 935.132.424.310 935.132.424.315 935.132.424.322 935.132.424.333 935.132.424.347 935.132.424.368 Temperature coefficient <1 %, from -55 C to +200 C 1 nF: 1.5 nF: 2.2 nF: 3.3 nF: 4.7 nF: 6.8 nF: 0.1 nF Breakdown voltage (BV) 11 VDC, 30VDC 935.132.424.410 935.132.424.415 935.132.424.422 935.132.424.433 935.132.424.447 935.132.424.468 47 nF: Capacitance variation versus 0.1 % /V (from 0 V to RVDC) 10 nF: 15 nF: 22 nF: 33 nF: 935.132.424.547 Contact RVDC 1 nF 935.132.424.510 935.132.424.515 935.132.424.522 935.132.424.533 935.132.724.547 IPDIA Sales Equivalent Serial Inductor (ESL) Max 100 pH 100 nF: (***) Equivalent Serial Resistor (ESR) Max 400mW 10 nF 935.132.424.610 50GW min 3V,25C Insulation resistance 20GW min 3V,200C (*) Thinner thickness (as low as 100 m thick) available, see Low Profile Silicon Capacitor product: LPSC Negligible, < 0.001 % / 1000 h Ageing Reliability FIT<0.017 parts / billion hours, (**) Extended temperature range (up to +250 C) available, see Xtreme Temperature Silicon Capacitor product: XTSC (*) Capacitor height Max 400 m (***) Other values on request. DC Voltage stability ESL (nH) 25C MLCC capacitors vs. PICS 0402 C0G(NPO) vs. PICS 10 1,1 PICS 0 1 C0G 0,9 -10 C0G -20 0,8 0,7 -30 X7R 0,6 -40 0,5 -50 0,4 -60 0,3 -70 0,2 -80 Y5V PICS 0,1 -90 0 -100 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 0 1 2 3 4 5 6 7 Capacitance (pF) Bias voltage (V) Fig.1 Capacitance change versus temperature Fig.3 ESL versus capacitance value Fig.2 Capacitance change versus voltage variation compared with alternative dielectrics compared with alternative dielectrics variation compared with alternative dielectrics Part Number 935.132. B.2 S. U xx Value 10 Breakdown 15 Voltage 22 Size Unit 4 = 11V 33 i.e.: 47 nF/0402 case (HTSC type) 4 = 0402 0 = 10 f 5 = 1 n 7 = 30V 47 1 = 0.1 p 6 = 10 n 935.132.424.547 68 2 = 1 p 7 = 0.1 3 = 10 p 8 = 1 4 = 0.1 n 9 = 10 Termination and Outline Termination Package outline Lead-free nickel/solder coating compatible L with automatic soldering technologies: Typ. 0402 reflow and manual. W L 1.200.05 Comp. Solder size IPD Land Resist W 0.700.05 component pattern Typical dimensions, all dimensions in mm. (0402 PCB footprint) Packaging Tape and reel, tray, waffle pack or wafer delivery. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information For more information, please visit: