HTSC425.xxx - 0603 High Temperature
Silicon Capacitor
Rev 3.1
Key features Key applications
All applications up to 200C, such as
High stability up to 200C:
military, aerospace and automotive
Temperature <1% (-55 C to +200 C)
industries
Voltage <0.1 %/V
High reliability applications
Negligible capacitance loss through aging
Replacement of X7R and C0G dielectrics
Unique high capacitance in EIA/0603 package
Decoupling / Filtering / Charge pump
size, up to 100 nF
(i.e.: motor management, temperature
sensors)
High reliability (FIT <0.017 parts / billion hours)
Lo w leakage current down to 100 pA Downsizing
Low ESL and Low ESR
Suitable for lead free reflow-soldering *Please refer
to our assembly Application Note for further recommendations
Thanks to the unique IPDiA Silicon capacitor The IPDiA technology offers industry leading
technology, most of the problems encountered in performances relative to Failure rate with a
demanding applications can be solved. FIT<0.017.
High Temperature Silicon Capacitors are This technology also offers high reliability, up to
dedicated to applications where reliability up to 10 times better than alternative capacitor
200 C is the main parameter.
technologies, such as Tantalum or MLCC, and
This technology features a capacitor integration eliminates cracking phenomena.
capability (up to 250nF/mm ) which offers This Silicon based technology is RoHS compliant
capacitance value similar to X7R dielectric, but and compatible with lead free reflow soldering
with better electrical performances than C0G/NP0 process.
dielectrics, up to 200C
HTSC provide the highest capacitor stability over
the full -55C/+200C temperature range in the
market with a Temperature coefficient
Lower than 1%.
Arial 18 Bold
Rev. Commercial Leaflet
HTSC425.xxx
Electrical specification
Capacitance value
Parameters Value
(***)
Capacitance range 100 nF
10 15 22 33 47 68
(***)
Capacitance tolerances 15 %
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(**)
10 pF IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales
Operating temperature range -55 C to 200 C
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- 70 C to 215 C
Storage temperatures
0.1 nF
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<1 %, from -55 C to +200 C
Temperature coefficient
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(***)
11 VDC
1 nF Breakdown voltage (BV)
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100 nF: Capacitance variation versus
0.1 % /V (from 0 V to RVDC)
10 nF 935.132.425.610
RVDC
Equivalent Serial Inductor (ESL) Max 250 pH
(*) Thinner thickness (as low as 100 m thick) available, see Low Profile Silicon Capacitor product: LPSC (***)
Equivalent Serial Resistor (ESR) Max 400m
50G min @ 3V,25C
Insulation resistance
(**) Extended temperature range (up to +250 C) available, see Xtreme Temperature Silicon Capacitor product: XTSC
20G min @ 3V,200C
Ageing Negligible, < 0.001 % / 1000 h
(***) Other values on request.
Reliability FIT<0.017 parts / billion hours,
(*)
Capacitor height Max 400 m
DC Voltage stability ESL (nH) @25C
MLCC capacitors vs. PICS 0402 C0G(NPO) vs. PICS
10 1,1
PICS
0 1
C0G
0,9
-10
C0G
0,8
-20
0,7
-30
X7R
0,6
-40
0,5
-50
0,4
-60
0,3
-70
0,2
-80
Y5V
PICS
0,1
-90
0
-100
0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000
0 1 2 3 4 5 6 7
Capacitance (pF)
Bias voltage (V)
Fig.1 Capacitance change versus temperature
Fig.2 Capacitance change versus voltage Fig.3 ESL versus capacitance value
variation compared with alternative dielectrics
variation compared with alternative dielectrics compared with alternative dielectrics
Part Number
935.132. B.2 S. U xx Value (E6)
10
Breakdown
15
Voltage
22
Size
4 = 11V
33
Unit
5 = 0603
i.e.: 100 nF/0603 case (HTSC type)
5 = 1 n
47
0 = 10 f
6 = 10 n
68
935.132.425.610 1 = 0.1 p
7 = 0.1
2 = 1 p
8 = 1
3 = 10 p
9 = 10
4 = 0.1 n
Termination and Outline
Termination
Package outline
Lead-free nickel/solder coating compatible
L
with automatic soldering technologies:
Typ. 0603
reflow and manual. W
1.800.05
L
Comp.
Solder
size
Land IPD
W 1.100.05 Resist
pattern component
Typical dimensions, all dimensions in mm.
(0603 PCB footprint)
Packaging
Tape and reel, tray, waffle pack or wafer delivery.
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