XTSC425.xxx - 0603 Extreme Temperature Silicon Capacitor Rev 3.1 Key fea tures Key applications n 250C requirements, High temperature n Ultra High temperature up to 250C: applications, such as military, aerospace, w Temperature Coeff : <1.5%(-55 C to +250C) automotive and downhole industries. w Voltage <0.1 %/V n High reliability applications w Negligible capacitance loss through aging n Replacement of X8R and C0G dielectrics n Unique high capacitance in EIA/0603 package n Decoupling / Filtering / Charge pump size, up to 100 nF (i.e.: pressure sensor, motor management) n High reliability (FIT <0.017 parts / billion hours) n Downsizing n Low leakage current down to 100 pA n Low ESL and Low ESR n Suitable for lead free reflow-soldering *Please refer to our assembly Application Note for further recommendations Tha nks to the unique IPDiA Silicon capacitor The IPDiA technology features a capacitor technology, most of the problems encountered in integration capability (up to 250nF/mm ) which demanding applications can be solved. allows a capacitance value similar to X8R EXtreme Temperature Silicon Capacitors are dielectric, but with better electrical performances appro priate for applications used in extreme than C0G/NP0 dielectrics. operating temperature range (up to 250C). This technology also offers high reliability, up to XTSC industry leading performances allow to 10 times better than alternative capacitor propose a 100nF in 0603 with a TC<1.5% over technologies, such as Tantalum or MLCC, and eliminates cracking phenomena. the full -55C/+250C temperature range. This Silicon based technology is RoHS compliant This technology also offers a negligible ageing and a stable insulation resistance, even at very and compatible with lead free reflow soldering process. high temperature, as well as a stable capacitor value over the full operating. XTSC425.xxx Electrical specification Capacitance value Parameters Value (**) Capacitance range 100 nF 10 15 22 33 47 68 (**) Capacitance tolerances 15 % Contact Contact Contact Contact Contact Contact 10 pF IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales -55 C to 250 C Operating temperature range Contact Contact Contact Contact Contact Contact Storage temperatures - 70 C to 265 C 0.1 nF IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales Temperature coefficient <1.5 %, from -55 C to +250 C Contact Contact Contact Contact Contact Contact (**) 1 nF Breakdown voltage (BV) 11 VDC IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales 100 nF: Capacitance variation versus 0.1 % /V (from 0 V to RVDC) 10 nF 935.133.425.610 RVDC Equivalent Serial Inductor (ESL) Max 250 pH (*) Thinner thickness (as low as 100 m thick) available, see Low Profile Silicon Capacitor product: LPSC (**) Equivalent Serial Resistor (ESR) Max 400mW 50GW min 3V,25C (**) Other values on request. Insulation resistance 10GW min 3V,250C Negligible, < 0.001 % / 1000 h Ageing Reliability FIT<0.017 parts / billion hours, (*) Capacitor height Max 400 m DC Voltage stability ESL (nH) 25C MLCC capacitors vs. PICS 0402 C0G(NPO) vs. PICS 10 1,1 PICS 1 0 C0G 0,9 -10 C0G 0,8 -20 0,7 -30 X7R 0,6 -40 0,5 -50 0,4 -60 0,3 -70 0,2 -80 Y5V PICS 0,1 -90 0 -100 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 0 1 2 3 4 5 6 7 Capacitance (pF) Bias voltage (V) Fig.1 Capacitance change versus temperature Fig.2 Capacitance change versus voltage Fig.3 ESL versus capacitance value variation compared with alternative dielectrics variation compared with alternative dielectrics compared with alternative dielectrics Part Number 935.133. B.2 S. U xx Value (E6) 10 Breakdown 15 Voltage 22 Size Unit 4 = 11V 33 i.e.: 100 nF/0603 case (XTSC type) 5 = 0603 5 = 1 n 0 = 10 f 47 1 = 0.1 p 6 = 10 n 68 935.133.425.610 7 = 0.1 2 = 1 p 8 = 1 3 = 10 p 4 = 0.1 n 9 = 10 Termination and Outline Termination Package outline Lead-free nickel/solder coating L compatible with automatic soldering Typ. 0603 W technologies: reflow and manual L 1.800.05 Comp. Solder size Land IPD W 1.100.05 Resist component pattern Typical dimensions, all dimensions in mm (0603 PCB footprint) Packaging Tape and reel, tray, waffle pack or wafer delivery Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information For more information, please visit: