Based on the Electrical Appliance and Material Safety Law of Japan Chip Multilayer Ceramic Capacitors for General Purpose GA255DR7E2104MW01 (2220, X7R:EIA, 0.1uF, AC250V) : packaging code Reference Sheet 1.Scope This specification is applied to Chip Multilayer Ceramic Capacitors based on the Electrical Appliance and Material Safety Law of Japan. For connecting lines to earth : 470 to 4700pF For connecting lines : 0.01 to 0.1uF <Reference Standard> GA2 series obtains no safefy approval. This Series is based on the standards of the Electrical Appliance and Material Safety Law of Janan, separated table 4. Do not use these products in any automotive power train or safety equipment including battery chargers for electric vehicles and plugin hybrids. 2.MURATA Part NO. System (Ex.) GA2 55 D R7 E2 104 M W01 L (1)L/W (2)T (3)Temperature (4)Rated (5)Nominal (6)Capacitance (7)Muratas Control (8)Packaging Code Dimensions Dimensions Characteristics Voltage Capacitance Tolerance Code 3. Type & Dimensions (Unit:mm) (1)-1 L (1)-2 W (2) T e g 5.70.4 5.00.4 2.0+0/-0.3 0.3 min. 3.2 min. 4.Rated value (3) Temperature Characteristics Specifications and Test (4) (6) (Public STD Code):X7R(EIA) (5) Nominal Methods Rated Capacitance (Operating Temp. coeff Temp. Range Capacitance Voltage Tolerance Temp. Range) orCap. Change (Ref.Temp.) -55 to 125 C AC 250 V 0.1 uF 20 % -15 to 15 % -55 to 125 C (25 C) Soldering Method Reflow 5.Package mark (8) Packaging Packaging Unit f180mm Reel L 1000 pcs./Reel EMBOSSED W12P8 f330mm Reel K 4000 pcs./Reel EMBOSSED W12P8 Product specifications in this catalog are as of Dec.9,2019,and are subject to change or obsolescence without notice. Please consult the approval sheet before ordering. Please read rating and Cautions first. GA255DR7E2104MW01-01 1 Specifications and Test Methods Test Method Item Specification No (Ref. Standard:JIS C 5101, IEC60384 1 Appearance No defects or abnormalities. Visual inspection. 2 Dimension Within the specified dimensions. Using calipers and micrometers. 3 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations Test Voltage : 10000pF min. AC575V(r.m.s.) less than 10000pF AC1500V(r.m.s.) Applied Time : 60+/-1s Charge/discharge current : 50mA max. 4 Insulation Resistance(I.R.) 2000 M or more Measurement Point : Between the terminations Measurement Voltage : DC500+/-50V Charging Time : 60+/-5s Measurement Temperature: Room Temperature 5 Capacitance Shown in Rated value. Measurement Temperature: Room Temperature Measurement Frequency : 1.0+/-0.1kHz 6 Dissipation Factor (D.F.) 0.025 max. Measurement Voltage : AC1.0+/-0.2V(r.m.s.) 7 Temperature R7 : Within +/-15% (-55C to +125C) The capacitance change should be measured after 5 min. Characteristics at each specified temp. stage. of Capacitance Capacitance value as a reference is the value in step 3. Step Temperature( C) 1 Reference Temp.+/-2 2 Min.Operating Temp. +/-3 3 Reference Temp. +/-2 4 Max.Operating Temp. +/-3 5 Reference Temp. +/-2 Pretreatment Perform a heat treatment at 150+0/-10C for 1h+/-5min and then let sit for 24+/-2h at room condition(*1). 8 Discharge Test No defects or abnormalities. As in below figure , discharge is made 50 times at 5s intervals from (Application : C < 10000pF) the capacitor (Cd) charged at DC voltage of specified. C : Nominal Capacitance Ct : Capacitor under test , Cd : 0.001F R1 : 1000 , R2 : 100 M , R3 : Surge resistance 9 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate A shown inComplement of Test method. Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion 10Hz to 55Hz to 10Hz (1min) Total amplitude : 1.5mm D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). 10 Solderability 95% of the terminations is to be soldered evenly and Test Method : Solder bath method continuously. Flux: Solution of rosin ethanol 25(wt)% Preheat : 80 to 120 for 10s to 30s Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) Solder Temp. : 245+/-5 Immersion time : 2+/-0.5s Immersing in speed : 25+/-2.5mm/s. 11 Resistance Appearance No defects or abnormalities. Test Method : Solder bath method to Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder) Soldering Capacitance Within +/-10% Solder Temp. : 260+/-5 Heat Change Immersion time : 10+/-1s Immersing in speed : 25+/-2.5mm/s. D.F. Within the specified initial value. Exposure Time : 24+/-2h at room condition(*1). Preheat : GA242 size min. : 100 to 120 for 1 min and 170 to 200 for 1 min I.R. Within the specified initial value. Pretreatment Perform a heat treatment at 150+0/-10C for 1h+/-5min and then Voltage proof No defects. let sit for 24+/-2h at room condition(*1). *1 Room Condition : Temperature:15 to 35C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa JEMCGS-03009B 2