X-On Electronics has gained recognition as a prominent supplier of ZPM3570-C Zigbee Modules - 802.15.4 across the USA, India, Europe, Australia, and various other global locations. ZPM3570-C Zigbee Modules - 802.15.4 are a product manufactured by Murata. We provide cost-effective solutions for Zigbee Modules - 802.15.4, ensuring timely deliveries around the world.

ZPM3570-C Murata

Name: ZPM3570-C
Brand: Murata
SKU: ZPM3570C_Murata
Availability: OutOfStock
Rating: 5 (11 reviews)

ZPM3570-C electronic component of Murata

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Part No.	ZPM3570-C
Manufacturer:	Murata
Category:	Zigbee Modules - 802.15.4
Description:	Zigbee 802.15.4 Modules 2.4GHz DSSS 802.15.4
Datasheet:	ZPM3570-C Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

2: USD 36.27 ea
Line Total: USD 72.54

Availability - 0

MOQ: 2 Multiples: 1
Pack Size: 1

ZPM3570-C More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Tue. 06 Aug to Mon. 12 Aug MOQ : 2 Multiples : 1	2 : USD 36.27 8 : USD 36.27 16 : USD 36.27 32 : USD 36.27 81 : USD 36.27 161 : USD 36.27

We are delighted to provide the ZPM3570-C from our Zigbee Modules - 802.15.4 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ZPM3570-C and other electronic components in the Zigbee Modules - 802.15.4 category and beyond.

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Additional Infomation About Product

ZPM3570 ZigBee Pro Module Data Sheet www.RFM.com Technical support +1.678.684.2000 Page 1 of 18 2011 by RF Monolithics, Inc. E-mail: tech sup rfm.com ZPM3570 Data Sheet - 05/25/11 Table of Contents 1 System Description.................................................................................................................................... 4 1.1 Applications............................................................................................................................................. 4 1.2 Module Summary.................................................................................................................................... 4 1.3 Block Diagram......................................................................................................................................... 4 1.4 Acronyms................................................................................................................................................ 5 2 Mechanical Specifications ......................................................................................................................... 5 2.1 Module Dimensions ................................................................................................................................ 5 2.2 Module Outline Drawing ......................................................................................................................... 5 2.3 Module Bottom View............................................................................................................................... 6 2.4 Detailed Mechanical Data (Top View) .................................................................................................... 6 2.5 Module Pin Out ....................................................................................................................................... 7 3 DC Electrical Specifications....................................................................................................................... 8 3.1 Typical Power Consumption................................................................................................................... 8 3.2 Digital IO Specifications.......................................................................................................................... 8 4 RF Specifications....................................................................................................................................... 9 5 Environmental Specifications..................................................................................................................... 9 5.1 Absolute Maximum Ratings.................................................................................................................... 9 5.2 Recommended Operating Conditions .................................................................................................... 9 6 Application Information ............................................................................................................................ 10 6.1 Connection Reference for the UART Host Interface ............................................................................ 10 6.2 Connection Reference for the SPI Host Interface ................................................................................ 10 6.3 Recommended Host (Customer) Circuit Board PCB Land Pattern...................................................... 11 6.4 Host PCB Layout Recommendations ................................................................................................... 12 6.5 Module Location ................................................................................................................................... 13 6.5.1 Location in x-y Plane ......................................................................................................................... 13 6.5.2 Location in z Plane ............................................................................................................................ 14 7 Assembly Information .............................................................................................................................. 14 7.1 Lead-free Reflow Soldering Profile...................................................................................................... 14 8 Package Information................................................................................................................................ 15 8.1 Tape and Reel Specifications............................................................................................................... 15 9 Ordering Information................................................................................................................................ 16 10 RoHS Declaration .................................................................................................................................. 16 11 Regulatory Information .......................................................................................................................... 16 11.1 FCC Notice (USA) .............................................................................................................................. 16 11.1.1 FCC Labeling Requirements ........................................................................................................... 17 11.1.2 RF Exposure.................................................................................................................................... 17 11.2 IC Notice (CANADA)........................................................................................................................... 17 11.3 CE Notice (EUROPE) ......................................................................................................................... 18 12 Technical Support Contact .................................................................................................................... 18 13 References............................................................................................................................................. 18 www.RFM.com Technical support +1.678.684.2000 Page 2 of 18 2011 by RF Monolithics, Inc. E-mail: tech sup rfm.com ZPM3570 Data Sheet - 05/25/11

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

Ipdia may also be referenced as

MU2
MUP
MUR
MURATA
Murata - TOKO
Murata / IPDiA
Murata Electronics
Murata Electronics N
Murata Electronics North America
MURATA MANUFACTURING
Murata Manufacturing Co.
Murata Power Solutio
Murata Power Solutions
Murata Power Solutions Inc
Murata Power Solutions Inc.
Toko
TOKO AMERICA
Toko America Inc.
TOKO, Inc.
TOKYO PARTS INDUSTRIAL
Tokyo Parts Industrial Group

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Manufacturer Murata Murata
Product Category Zigbee Modules - 802.15.4 Zigbee Modules - 802.15.4
RoHS - XON Y Y
Sensitivity - 103 Dbm - 103 Dbm
Operating Supply Voltage 2.4 v to 3.4 V 2.4 v to 3.4 V
Supply Current Transmitting 175 mA 175 mA
Supply Current Receiving 35 mA 35 mA
Output Power 20 dBm 20 dBm
Maximum Operating Temperature + 85 C + 85 C
Minimum Operating Temperature - 40 C - 40 C
Packaging Bulk Bulk
Dimensions 27.2 Mm X 14.75 Mm X 2.9 Mm 27.2 Mm X 14.75 Mm X 2.9 Mm
Brand Murata Murata
Frequency Band 2.4 GHz to 2.5 GHz 2.4 GHz to 2.5 GHz
Interface Type Gpio, I2c, Spi, Uart Gpio, I2c, Spi, Uart
Antenna Connector Type Integrated Integrated
Modulation Technique Dsss Dsss
Factory Pack Quantity : 50 50