74HC08D-Q100,118 Nexperia

74HC08-Q100 74HCT08-Q100 Quad 2-input AND gate Rev. 2 13 June 2017 Product data sheet 1 General description The 74HC08-Q100 74HCT08-Q100 is a quad 2-input AND gate. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of V . CC This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2 Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from -40 C to +85 C and from -40 C to +125 C Complies with JEDEC standard JESD7A Input levels: For 74HC08-Q100: CMOS level For 74HCT08-Q100: TTL level ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) Multiple package options 3 Ordering information Table 1. Ordering information Type number Package Temperature Name Description Version range 74HC08D-Q100 -40 C to +125 C SO14 plastic small outline package 14 leads SOT108-1 body width 3.9 mm 74HCT08D-Q100 74HC08PW-Q100 -40 C to +125 C TSSOP14 plastic thin shrink small outline package SOT402-1 14 leads body width 4.4 mm 74HCT08PW-Q100 74HC08BQ-Q100 -40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal SOT762-1 enhanced very thin quad flat package no leads 74HCT08BQ-Q100 14 terminals body 2.5 3 0.85 mmNexperia 74HC08-Q100 74HCT08-Q100 Quad 2-input AND gate 4 Functional diagram 1 & 3 2 4 & 6 1 1A 1Y 3 5 2 1B 4 2A 2Y 6 9 5 2B & 8 10 9 3A 3Y 8 10 3B A 12 12 4A & 4Y 11 11 Y 13 4B 13 B mna222 mna223 mna221 Figure 1. Logic symbol Figure 2. IEC logic symbol Figure 3. IEC logic symbol 5 Pinning information 5.1 Pinning 74HC08-Q100 74HCT08-Q100 terminal 1 index area 1B 2 13 4B 74HC08-Q100 1Y 3 12 4A 74HCT08-Q100 2A 4 11 4Y 1A 1 14 V CC 2B 5 10 3B (1) GND 1B 2 13 4B 2Y 6 9 3A 1Y 3 12 4A aaa-004039 2A 4 11 4Y Transparent top view 2B 5 10 3B (1) This is not a supply pin. The substrate is attached to 2Y 6 9 3A this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. GND 7 8 3Y However, if it is soldered, the solder land should remain aaa-004038 floating or be connected to GND. Figure 4. Pin configuration SO14 and TSSOP14 Figure 5. Pin configuration DHVQFN14 74HC HCT08 Q100 All information provided in this document is subject to legal disclaimers. Nexperia B.V. 2017. All rights reserved. Product data sheet Rev. 2 13 June 2017 2 / 15 GND 7 1 1A 3Y 8 14 V CC