The first leadless package with solderable side pads Solderable (Tin-plated) exposed side pads Easy visible inspection of solder pads Very high mechanical robustness Post-soldering stability Full thermal, electrical, mounting and footprint compatibility to leadless 1006 mm packages (inch: 0402) Height only 0.37 mm Built for a range of functions Protection, Switching and Schottky diodes Ideal for small and thin devices Discrete Semiconductors Selection Guide 2011 www.nxp.com Diodes, protection and signal conditioning devices, Get ready to improve your ultra-flat bipolar transistors, MOSFETs, thyristors PCB design with our SOD882D package. 2011 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. 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Date of release: January 2011 Document order number: 9397 750 17022 Printed in the Netherlands Discrete Semiconductors packages portfolio and highlights Discrete Semiconductors packages portfolio and highlights Small SMD packages with 2 - 6 pins Small SMD packages with 2 - 6 pins body length body length FlatPower with clip bond for highest power ratings in a small SMD package 6.5 mm FlatPower with clip bond for highest 400 / 600 W TVS diodes (p. 48, 49) 6.5 mm power ratings in a small SMD package 1 - 5 A Schottky rectifiers (p. 10) Power-SO8 400 / 600 W TVS diodes (p. 48, 49) (LFPAK) 1 - 5 A Schottky rectifiers (p. 10) SOT223 Power-SO8 (SC-73) (LFPAK) 4.5 mm SOT223 SOT89 (SC-73) 4.5 mm (SC-62) SOT89 SOD128 (SC-62) 3.5 mm SOD128 SOD80C 3.5 mm With exposed heat sink for excellent thermal conductivity With exposed heat sink for SOD80C excellent thermal conductivity With exposed heat sink for excellent P-Ch. MOSFET, MOSFET-Schottky (p. 76) thermal conductivity 2.9 mm MOSFET-low V BISS transistor With exposed heat sink for Low V transistors (p. 60 ff) CEsat CEsat combination (p. 67) excellent thermal conductivity Schottky rectifiers (p. 11, 12) P-Ch. MOSFET, MOSFET-Schottky (p. 76) 2.9 mm MOSFET-low V BISS transistor Low V transistors (p. 60 ff) CEsat SOT457 CEsat SOT143B combination (p. 67) SOT23 Schottky rectifiers (p. 11, 12) (SC-74) SOD123F SOD123W SOT457 SOT143B SOT23 (SC-74) SOD123F 2.0 mm SOD123W 2.0 mm SOT1061 SOT353 SOT323 (HUSON3) SOT363 SOT1118 (SC-88A) (SC-70) (SC-88) SOD323 SOD323F SOT1061 SOT353 (SC-76) (SC-90) SOT323 (HUSON3) SOT363 SOT1118 (SC-88A) (SC-70) (SC-88) 1.6 mm Industrys smallest SOD323 SOD323F (SC-76) (SC-90) plastic package for 1.6 mm SOT663 Industrys smallest SOT416 LDOs , 150 mA (p. 96) SOT665 SOT666 (SC-75) plastic package for SOT663 SOT886 SOT416 LDOs , 150 mA (p. 96) SOD882D / SOD882 SOD523 (SC-79) SOT665 SOT666 (XSON6) (SC-75) 0603 mm / 0201 inch footprint, only 1.0 mm SOT886 0.3 mm high SOD523 (SC-79) SOD882D / SOD882 (XSON6) 0603 mm / 0201 inch footprint, only SOT891 1.0 mm Very high ESD protection levels and SOT883 SOT1194 (XSON6) First leadless package with tin-plated 0.3 mm high low capacitances (p. 22 ff) (SC-101) SOD962 solderable side pads, only 0.37 mm high SOT891 Very high ESD protection levels and SOT883 SOT1194 (XSON6) First leadless package with tin-plated low capacitances (p. 22 ff) ESD protection (p. 22 ff) (SC-101) SOD962 solderable side pads, only 0.37 mm high 2 pins 3 pins 4-6 pins Schottky (p. 11) and switching (p.17) diodes ESD protection (p. 22 ff) 2 pins 3 pins 4-6 pins Schottky (p. 11) and switching (p.17) diodes Small SMD packages with 8 pins and more Through-hole and SMD packages with total length of + 9 mm Small SMD packages with 8 pins and more Through-hole and SMD packages with total length of + 9 mm total length body length body length total length 6 mm 30 mm SOT78 SOT186A 6 mm 30 mm SOD113 SOT337 SOT78 (SSOP14) SOT186A SOD113 SOT337 (SSOP14) SOD59 5 mm SOD59 5 mm 25 mm SOT82 SOT617 (HVQFN32) SOT96 (SO8) 25 mm SOT82 SOT617 SOT96 (SO8) (HVQFN32) 4 mm SOT226A 4 mm New RF-optimized package for very SOT226A fast data lines with 0.5 mm pitch, enables pass through routing 20 mm New RF-optimized package for very - ESD protection (p. 30 ff) fast data lines with 0.5 mm pitch, enables pass through routing 20 mm - ESD protection (p. 30 ff) 3 mm SOT873 (HVSON8) SOT552 3 mm SOT505 (TSSOP10) SOT873 (TSSOP8) (HVSON8) SOT552 SOT1176 SOT1158 SOT505 (XSON10) (TSSOP10) (HXSON12) SOT54 (TSSOP8) SOT1176 SOT1158 15 mm (XSON10) (HXSON12) SOT54 2 mm SOT533 SOT404 15 mm 2 mm SOT1178 SOT533 SOT1156 (XSON9) SOT404 (HXSON12) SOT1157 SOT1178 New very small package for very SOT1156 SOT510 (HXSON8) (XSON9) (HXSON12) (TSSOP38) fast data lines with 0.4 mm pitch, enables pass through routing SOT1157 New very small package for very SOT510 1 mm (HXSON8) - ESD protection (p. 30 ff) (TSSOP38) fast data lines with 0.4 mm pitch, enables pass through routing 10 mm 1 mm - ESD protection (p. 30 ff) SOT428 10 mm SOT428 8 - 10 pins 12 pins and more 2 pins 3 pins 38 pins 8 - 10 pins 12 pins and more 2 pins 3 pins 38 pins