IP4064CX8/LF/P NXP

IP4064CX8 IP4364CX8 IP4366CX8 Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4 Rev. 02 11 February 2010 Product data sheet 1. Product profile 1.1 General description The IP4064CX8, IP4364CX8 and IP4366CX8 are 3-channel RC low-pass filter arrays which are designed to provide filtering of undesired RF signals in the 800 MHz to 3 000 MHz frequency band. In addition, the IP4064CX8, IP4364CX8 and IP4366CX8 incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as 15 kV contact discharge according the IEC 61000-4-2 model, far exceeding standard level 4. All three devices are fabricated using monolithic silicon technology and integrate three resistors and seven high-level ESD-protection diodes in a single Wafer-Level Chip-Scale Package (WLCSP). These features make the IP4064CX8, IP4364CX8 and IP4366CX8 ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features and benefits Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) 3-channel SIM card interface integrated RC filter array Integrated 100 /100 /47 series channel resistors Integrated ESD protection withstanding 15 kV contact discharge, far exceeding IEC 61000-4-2 level 4 WLCSP with 0.4 mm pitch (IP4364CX8 and IP4366CX8) and 0.5 mm pitch (IP4064CX8) 1.3 Applications SIM interfaces in e.g. cellular and Personal Communication System (PCS) mobile handsetsIP4064CX8 IP4364CX8 IP4366CX8 NXP Semiconductors Integrated SIM card passive filter array with ESD protection 2. Pinning information 2.1 Pinning bump A1 index area 1 23 A B C 008aaa206 transparent top view, solder balls facing down Fig 1. Pin configuration 2.2 Pin description Table 1. Pinning Pin Description A1 not connected (missing ball) A2 external pin 1 A3 internal pin 1 B1 external pin 2 B2 ground B3 internal pin 2 C1 external pin 3 C2 supply ESD protection C3 internal pin 3 3. Ordering information Table 2. Ordering information Type number Package Name Description Version IP4064CX8/LF/P WLCSP8 wafer level chip-size package 8 bumps 1.41 1.41 0.65 mm IP4064CX8/LF/P IP4364CX8/LF/P WLCSP8 wafer level chip-size package 8 bumps 1.16 1.16 0.61 mm IP4364CX8/LF/P IP4366CX8/P WLCSP8 wafer level chip-size package 8 bumps 1.16 1.16 0.61 mm IP4366CX8/P IP4064CX8 IP4364CX8 IP4366CX8 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 11 February 2010 2 of 14