Document Number: K10P64M50SF0 Freescale Semiconductor Rev. 4 5/2012 Data Sheet: Technical Data K10P64M50SF0 K10 Sub-Family Supports the following: MK10DN32VLH5, MK10DX32VLH5, MK10DN64VLH5, MK10DX64VLH5, MK10DN128VLH5, MK10DX128VLH5, MK10DN32VMP5, MK10DX32VMP5, MK10DN64VMP5, MK10DX64VMP5, MK10DN128VMP5, MK10DX128VMP5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Analog modules Performance 16-bit SAR ADC Up to 50 MHz ARM Cortex-M4 core with DSP Two analog comparators (CMP) containing a 6-bit instructions delivering 1.25 Dhrystone MIPS per DAC and programmable reference input MHz Voltage reference Memories and memory interfaces Timers Up to 128 KB program flash. Programmable delay block Up to 32 KB FlexNVM on FlexMemory devices Eight-channel motor control/general purpose/PWM 2 KB FlexRAM on FlexMemory devices timer Up to 16 KB RAM Two-channel quadrature decoder/general purpose Serial programming interface (EzPort) timer Periodic interrupt timers Clocks 16-bit low-power timer 3 to 32 MHz crystal oscillator Carrier modulator transmitter 32 kHz crystal oscillator Real-time clock Multi-purpose clock generator Communication interfaces System peripherals SPI module Multiple low-power modes to provide power I2C module optimization based on application requirements Three UART modules 4-channel DMA controller, supporting up to 41 I2S module request sources External watchdog monitor Software watchdog Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.3.2 General switching specifications...........................20 1.1 Determining valid orderable parts......................................3 5.4 Thermal specifications.......................................................21 2 Part identification......................................................................3 5.4.1 Thermal operating requirements...........................21 2.1 Description.........................................................................3 5.4.2 Thermal attributes.................................................21 2.2 Format...............................................................................3 6 Peripheral operating requirements and behaviors....................22 2.3 Fields.................................................................................3 6.1 Core modules....................................................................22 2.4 Example............................................................................4 6.1.1 JTAG electricals....................................................22 3 Terminology and guidelines......................................................4 6.2 System modules................................................................25 3.1 Definition: Operating requirement......................................4 6.3 Clock modules...................................................................25 3.2 Definition: Operating behavior...........................................5 6.3.1 MCG specifications...............................................25 3.3 Definition: Attribute............................................................5 6.3.2 Oscillator electrical specifications.........................27 3.4 Definition: Rating...............................................................6 6.3.3 32 kHz Oscillator Electrical Characteristics...........29 3.5 Result of exceeding a rating..............................................6 6.4 Memories and memory interfaces.....................................30 3.6 Relationship between ratings and operating 6.4.1 Flash electrical specifications................................30 requirements......................................................................6 6.4.2 EzPort Switching Specifications............................34 3.7 Guidelines for ratings and operating requirements............7 6.5 Security and integrity modules..........................................35 3.8 Definition: Typical value.....................................................7 6.6 Analog...............................................................................35 3.9 Typical value conditions....................................................8 6.6.1 ADC electrical specifications.................................35 4 Ratings......................................................................................9 6.6.2 CMP and 6-bit DAC electrical specifications.........40 4.1 Thermal handling ratings...................................................9 6.6.3 Voltage reference electrical specifications............43 4.2 Moisture handling ratings..................................................9 6.7 Timers................................................................................44 4.3 ESD handling ratings.........................................................9 6.8 Communication interfaces.................................................44 4.4 Voltage and current operating ratings...............................9 6.8.1 DSPI switching specifications (limited voltage 5 General.....................................................................................10 range)....................................................................44 5.1 AC electrical characteristics..............................................10 6.8.2 DSPI switching specifications (full voltage range).46 5.2 Nonswitching electrical specifications...............................10 6.8.3 I2C switching specifications..................................48 5.2.1 Voltage and current operating requirements.........10 6.8.4 UART switching specifications..............................48 5.2.2 LVD and POR operating requirements.................11 6.8.5 I2S/SAI Switching Specifications..........................48 5.2.3 Voltage and current operating behaviors..............12 6.9 Human-machine interfaces (HMI)......................................52 5.2.4 Power mode transition operating behaviors..........13 6.9.1 TSI electrical specifications...................................52 5.2.5 Power consumption operating behaviors..............14 7 Dimensions...............................................................................54 5.2.6 EMC radiated emissions operating behaviors.......18 7.1 Obtaining package dimensions.........................................54 5.2.7 Designing with radiated emissions in mind...........19 8 Pinout........................................................................................54 5.2.8 Capacitance attributes..........................................19 8.1 K10 Signal Multiplexing and Pin Assignments..................54 5.3 Switching specifications.....................................................19 8.2 K10 Pinouts.......................................................................57 5.3.1 Device clock specifications...................................19 9 Revision History........................................................................59 K10 Sub-Family Data Sheet, Rev. 4 5/2012. 2 Freescale Semiconductor, Inc.