X-On Electronics has gained recognition as a prominent supplier of ISD4003-04MEYI across the USA, India, Europe, Australia, and various other global locations. ISD4003-04MEYI are a product manufactured by Nuvoton. We provide cost-effective solutions for ISD4003-04MEYI, ensuring timely deliveries around the world.

ISD4003-04MEYI Nuvoton

ISD4003-04MEYI electronic component of Nuvoton
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See Product Specifications
Part No.ISD4003-04MEYI
Manufacturer: Nuvoton
Category: Unclassified
Description: 240s Voice Record and Playback 28-Pin TSOP-I
Datasheet: ISD4003-04MEYI Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
5: USD 15.1004 ea
Line Total: USD 75.5 
Availability - 0
MOQ: 5  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 14 Nov to Wed. 20 Nov
MOQ : 5
Multiples : 1
5 : USD 15.1004
10 : USD 14.0901
25 : USD 13.2098
100 : USD 12.6576

   
Manufacturer
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We are delighted to provide the ISD4003-04MEYI from our Nuvoton manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ISD4003-04MEYI and other electronic components in the Nuvoton manufacturer and beyond.

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ISD4003 SERIES ISD4003 SERIES SINGLE-CHIP, MULTIPLE-MESSAGES VOICE RECORD/PLAYBACK DEVICES 4-, 5-, 6-, AND 8-MINUTE DURATION Publication Release Date: Oct 31, 2008 - 1 - Revision 1.31 ISD4003 SERIES 1. GENERAL DESCRIPTION ............................................................................................................... 3 2. FEATURES ....................................................................................................................................... 4 3. BLOCK DIAGRAM ............................................................................................................................ 5 4. PIN CONFIGURATION ..................................................................................................................... 6 5. PIN DESCRIPTION ........................................................................................................................... 7 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 12 6.1. Detailed Description ................................................................................................................ 12 6.2. Serial Peripheral Interface (SPI) Description .......................................................................... 13 6.2.1 OPCODES ....................................................................................................................... 14 6.2.2 SPI Diagrams ................................................................................................................... 15 6.2.3 SPI Control and Output Registers .................................................................................... 16 7. TIMING DIAGRAMS ....................................................................................................................... 18 8. ABSOLUTE MAXIMUM RATINGS.................................................................................................. 20 8.1. Operating Conditions............................................................................................................... 21 9. ELECTRICAL CHARACTERISTICS ............................................................................................... 22 9.1. Parameters For Packaged Parts ............................................................................................. 22 9.2. Parameters For Die ................................................................................................................. 25 9.3. SPI AC Parameters ................................................................................................................. 26 10. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27 11. PACKAGING AND DIE INFORMATION ......................................................................................... 30 11.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC) ................................................................ 30 11.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) .......................................................... 31 11.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC ................. 32 11.4. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ........................... 33 11.5. Die Information .................................................................................................................... 34 12. ORDERING INFORMATION .......................................................................................................... 36 13. VERSION HISTORY ....................................................................................................................... 37 Publication Release Date: Oct 31, 2008 - 2 - Revision 1.31

Nuvoton Technology
Nuvoton Technology Corporation of America
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