5962-8972301EA NXP

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 07-08-06 Robert M. Heber The original first sheet of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Tim H. Noh DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD Tim H. Noh 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89723 01 E X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F259 8-bit addressable latch 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Leadless square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range ....................................................................... -0.5 V dc minimum to +7.0 V dc maximum Input voltage range .......................................................................... -0.5 V dc minimum to +7.0 V dc maximum Input current range .......................................................................... -30 mA to +5.0 mA Voltage applied to output in high output state range ....................... -0.5 V dc to +V CC Current applied to output in low output state ................................... 40 mA Storage temperature range ............................................................. -65C to +150C Maximum power dissipation (P ) 1/ ................................................ 413 mW D Lead temperature (soldering, 10 seconds) ...................................... +300C Thermal resistance, junction-to-case ( ) ...................................... See MIL-STD-1835 JC Junction temperature (T ) ................................................................ +175C J 1/ Must withstand the added PD due to short circuit test e.g., I . OS SIZE STANDARD 5962-89723 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 A 2 DSCC FORM 2234 APR 97