74AUP1G157GM NXP

74AUP1G157 Low-power 2-input multiplexer Rev. 6 16 September 2015 Product data sheet 1. General description The 74AUP1G157 is a single 2-input multiplexer which selects data from two data inputs (I0 and I1) under control of a common data select input (S). The state of the common data select input determines the particular register from which the data comes. The output (Y) presents the selected data in the true (non-inverted) form. Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire V range from 0.8 V to 3.6 V. CC This device ensures a very low static and dynamic power consumption across the entire V range from 0.8 V to 3.6 V. CC This device is fully specified for partial power-down applications using I . OFF The I circuitry disables the output, preventing the damaging backflow current through OFF the device when it is powered down. 2. Features and benefits Wide supply voltage range from 0.8 V to 3.6 V High noise immunity Complies with JEDEC standards: JESD8-12 (0.8 V to 1.3 V) JESD8-11 (0.9 V to 1.65 V) JESD8-7 (1.2 V to 1.95 V) JESD8-5 (1.8 V to 2.7 V) JESD8-B (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F Class 3A exceeds 5000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1000 V Low static power consumption; I = 0.9 A (maximum) CC Latch-up performance exceeds 100 mA per JESD 78 Class II Inputs accept voltages up to 3.6 V Low noise overshoot and undershoot < 10 % of V CC I circuitry provides partial Power-down mode operation OFF Multiple package options Specified from 40 Cto+85 C and 40 Cto+125 C74AUP1G157 NXP Semiconductors Low-power 2-input multiplexer 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP1G157GW 40 C to +125 C SC-88 plastic surface-mounted package; 6 leads SOT363 74AUP1G157GM 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 1.45 0.5 mm 74AUP1G157GF 40 C to +125 C XSON6 plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 1 0.5 mm 74AUP1G157GN 40 C to +125 C XSON6 extremely thin small outline package; no leads; SOT1115 6 terminals; body 0.9 1.0 0.35 mm 74AUP1G157GS 40 C to +125 C XSON6 extremely thin small outline package; no leads; SOT1202 6 terminals; body 1.0 1.0 0.35 mm 74AUP1G157GX 40 C to +125 C X2SON6 plastic thermal extremely thin small outline package; SOT1255 no leads; 6 terminals; body 1 0.8 0.35 mm 4. Marking Table 2. Marking [1] Type number Marking code 74AUP1G157GW aP 74AUP1G157GM aP 74AUP1G157GF aP 74AUP1G157GN aP 74AUP1G157GS aP 74AUP1G157GX aP [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram   , ,  6  ; <       Fig 1. Logic symbol Fig 2. IEC logic symbol 74AUP1G157 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 16 September 2015 2 of 21 DDF DDF 08  *