74AUP1T97GS,132 NXP

74AUP1T97 Low-power configurable gate with voltage-level translator Rev. 6 28 March 2017 Product data sheet 1 General description The 74AUP1T97 provides low-power, low-voltage configurable logic gate functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter and buffer. All inputs can be connected to V or GND. CC This device ensures a very low static and dynamic power consumption across the entire V range from 2.3 V to 3.6 V. CC The 74AUP1T97 is designed for logic-level translation applications with input switching levels that accept 1.8 V low-voltage CMOS signals, while operating from either a single 2.5 V or 3.3 V supply voltage. The wide supply voltage range ensures normal operation as battery voltage drops from 3.6 V to 2.3 V. This device is fully specified for partial power-down applications using I . The I OFF OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. Schmitt trigger inputs make the circuit tolerant to slower input rise and fall times across the entire V range. CC 2 Features and benefits Wide supply voltage range from 2.3 V to 3.6 V High noise immunity ESD protection: HBM JESD22-A114F Class 3A exceeds 5 000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1 000 V Low static power consumption I = 1.5 A (maximum) CC Latch-up performance exceeds 100 mA per JESD 78 Class II Inputs accept voltages up to 3.6 V Low noise overshoot and undershoot < 10 % of V CC I circuitry provides partial power-down mode operation OFF Multiple package options Specified from -40 C to +85 C and -40 C to +125 CNexperia 74AUP1T97 Low-power configurable gate with voltage-level translator 3 Ordering information Table 1. Ordering information Type number Package Temperature Name Description Version range 74AUP1T97GW -40 C to +125 C SC-88 plastic surface-mounted package 6 leads SOT363 74AUP1T97GM -40 C to +125 C XSON6 plastic extremely thin small outline package SOT886 no leads 6 terminals body 1 x 1.45 x 0.5 mm 74AUP1T97GF -40 C to +125 C XSON6 plastic extremely thin small outline package SOT891 no leads 6 terminals body 1 x 1 x 0.5 mm 74AUP1T97GN -40 C to +125 C XSON6 extremely thin small outline package no leads SOT1115 6 terminals body 0.9 x 1.0 x 0.35 mm 74AUP1T97GS -40 C to +125 C XSON6 extremely thin small outline package no leads SOT1202 6 terminals body 1.0 x 1.0 x 0.35 mm 74AUP1T97GX -40 C to +125 C X2SON6 plastic thermal extremely thin small SOT1255 outline package no leads 6 terminals body 1 x 0.8 x 0.35 mm 74AUP1T97UK -40 C to +125 C WLCSP6 wafer level chip-scale package 6 bumps SOT1454-1 0.65 x 0.44 x 0.27 mm 4 Marking Table 2. Marking 1 Type number Marking code 74AUP1T97GW 59 74AUP1T97GM 59 74AUP1T97GF 59 74AUP1T97GN 59 74AUP1T97GS 59 74AUP1T97GX 59 74AUP1T97UK 9 1 The pin 1 indicator is located on the lower left corner of the device, below the marking code. 74AUP1T97 All information provided in this document is subject to legal disclaimers. Nexperia B.V. 2017. All rights reserved. Product data sheet Rev. 6 28 March 2017 2 / 23