BAS86 NXP

BAS86 Schottky barrier single diode 25 July 2012 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device (SMD) package with tin-plated metal discs at each end. It is suitable for automatic placement and as such it can withstand immersion soldering. 1.2 Features and benefits Low forward voltage High breakdown voltage Guard ring protected Hermetically sealed glass SMD package. 1.3 Applications Ultra high-speed switching Voltage clamping Protection circuits Blocking diodes 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I average forward 1 - - 200 mA F(AV) current V reverse voltage - - 50 V R V forward voltage I = 100 mA T = 25 C - - 900 mV F F amb 1 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Scan or click this QR code to view the latest information for this productNXP Semiconductors BAS86 Schottky barrier single diode 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K cathode 1 K A k a aaa-003679 2 A anode LLDS MiniMelf (SOD80C) 1 The marking band indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAS86 LLDS hermetically sealed glass surface-mounted package 2 SOD80C MiniMelf connectors 4. Marking Table 4. Marking codes Type number Marking code BAS86 marking band 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 50 V R I forward current - 200 mA F I average forward current 1 - 200 mA F(AV) I repetitive peak forward current t 1 s 0.5 - 500 mA FRM p I non-repetitive peak forward t = 10 ms T = 25 C - 5 A FSM p j(init) current T junction temperature - 125 C j T ambient temperature -65 125 C amb T storage temperature -65 150 C stg 1 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAS86 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved Product data sheet 25 July 2012 2 / 9