Product Information

BGA2874,115

BGA2874,115 electronic component of NXP

Datasheet
NXP Semiconductors RF Amplifier MMIC wideband amp
Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 1.1753
10 : USD 0.943
100 : USD 0.233
500 : USD 0.1934
1000 : USD 0.1517
3000 : USD 0.1507
N/A

Obsolete

Read More Specifications

     
Manufacturer
Product Category
Mounting Style
Package / Case
Operating Frequency
P1dB - Compression Point
Gain
NF - Noise Figure
OIP3 - Third Order Intercept
Packaging
Brand
Factory Pack Quantity :
Rohs Mouser
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
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Additional Infomation About Product

BGA2874 MMIC wideband amplifier Rev. 3 3 October 2016 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. 1.2 Features and benefits Internally matched to 50 A gain of 31.0 dB at 750 MHz Output power at 1 dB gain compression = 5 dBm Supply current = 16.5 mA at a supply voltage of 2.5 V Reverse isolation > 52 dB up to 750 MHz Good linearity with low second order and third order products Noise figure = 3.1 dB at 500 MHz Unconditionally stable (K > 1) No output inductor required 1.3 Applications LNB IF amplifiers General purpose low noise wideband amplifier for frequencies between DC and 750 MHz 2. Pinning information Table 1. Pinning Pin Description Simplified outline Graphic symbol 1V CC 6 5 4 1 2, 5 GND2 6 3 3RF OUT 4 GND1 4 2, 5 132 6RF IN sym052BGA2874 NXP Semiconductors MMIC wideband amplifier 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BGA2874 - plastic surface-mounted package 6 leads SOT363 4. Marking Table 3. Marking Type number Marking code Description BGA2874 LR* * = - : made in Hong Kong * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage RF input AC coupled 0.5 +3.6 V CC I supply current - 55 mA CC P total power dissipation T = 90 C-200mW tot sp T storage temperature 40 +125 C stg T junction temperature - 125 C j P drive power - +10 dBm drive 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to P = 200 mW T =90 C 300 K/W th(j-sp) tot sp solder point 7. Characteristics Table 6. Characteristics V = 2.5 V Z = Z = 50 P = 40 dBm T = 25 C measured on demo board unless otherwise specified. CC S L i amb Symbol Parameter Conditions Min Typ Max Unit V supply voltage 2.3 2.5 2.7 V CC I supply current 14.0 16.5 19.0 mA CC BGA2874 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet Rev. 3 3 October 2016 2 of 13

HS Compliance

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:

NXP may also be referenced as

FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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