X-On Electronics has gained recognition as a prominent supplier of BGA6130,118 RF Amplifier across the USA, India, Europe, Australia, and various other global locations. BGA6130,118 RF Amplifier are a product manufactured by NXP. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

BGA6130,118 NXP

BGA6130,118 electronic component of NXP
BGA6130,118 NXP
BGA6130,118 RF Amplifier
BGA6130,118  Semiconductors

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See Product Specifications
Part No. BGA6130,118
Manufacturer: NXP
Category: RF Amplifier
Description: RF Amplifier Hi EFF Amp 2700MHz
Datasheet: BGA6130,118 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 9.276 ea
Line Total: USD 9.28 
Availability - 15391
Ship by Mon. 07 Apr to Wed. 09 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
15391
Ship by Mon. 07 Apr to Wed. 09 Apr
MOQ : 1
Multiples : 1
1 : USD 9.276
10 : USD 7.414
25 : USD 7.073
100 : USD 6.567
250 : USD 6.259
500 : USD 6.05
1000 : USD 5.742
2500 : USD 5.742
6000 : USD 5.654

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Operating Supply Current
Packaging
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We are delighted to provide the BGA6130,118 from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BGA6130,118 and other electronic components in the RF Amplifier category and beyond.

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BGA6130 1 2 6 9 400 MHz to 2700 MHz 1 W high efficiency silicon amplifier + Rev. 2 12 February 2014 Product data sheet 1. General description The MMIC is a one-stage amplifier, offered in a low-cost leadless surface-mount package. At 3.6 V it delivers 29.5 dBm output power at 3 dB gain compression with efficiency higher than 55 %. Its power saving features include simple quiescent current adjustment, which allows class-AB operation and logic-level shutdown control to reduce the supply current to 4 A. 2. Features and benefits 400 MHz to 2700 MHz frequency operating range Integrated active biasing External matching allows broad application optimization of the electrical performance Efficiencies higher than 55 % 3.6 V single supply operation Power-down Excellent robustness: All pins ESD protected (HBM 6 kV CDM 2 kV) Withstands mismatch of VSWR 50 : 1 through all phases Withstands electrical over-stress peaks of 4.5 V on the supply voltage 3. Applications In this data sheet two Industrial, Scientific and Medical (ISM) applications are described, namely ISM at 434 MHz and ISM at 915 MHz. The BGA6130 is also suited for a range of other applications: Broadband CPE / MoCA WLAN / ISM / RFID Wireless Sensor Network (WSN) Industrial applications Satellite Master Antenna TV (SMATV)BGA6130 NXP Semiconductors 400 MHz to 2700 MHz 1 W high efficiency silicon amplifier 4. Quick reference data Table 1. Quick reference data 3.3 V V 3.9 V 40 C T +85 C P < 20 dBm R3 = 3900 (tolerance 10 %) input and output impedances SUP case i matched to 50 (see Section 14) pin ENABLE = HIGH unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1 V supply voltage 3.3 3.6 3.9 V SUP 2 I total supply current 50 70 90 mA CC(tot) 2 1k R3 5k 30 - 250 mA 2 1k R3 5k pin ENABLE = LOW -4 6 A 3 T case temperature 40 +25 +85 C case f frequency 400 - 2700 MHz Measured at ISM-434 MHz (see Section 14) f frequency 433 434 435 MHz G power gain 433 MHz f 435 MHz 14 17 20 dB p P output power at 1 dB gain compression 433 MHz f 435 MHz 25 28 - dBm L(1dB) P output power at 3 dB gain compression 433 MHz f 435 MHz - 29.5 - dBm L(3dB) efficiency 433 MHz f 435 MHz at P -56 - % L(3dB) Measured at ISM-915 MHz (see Section 14) f frequency 902 915 928 MHz G power gain 902 MHz f 928 MHz 11 14 17 dB p P output power at 1 dB gain compression 902 MHz f 928 MHz 26 29 - dBm L(1dB) P output power at 3 dB gain compression 902 MHz f 928 MHz - 30 - dBm L(3dB) efficiency 902 MHz f 928 MHz at P -60 - % L(3dB) 1 Supply voltage on pins RF OUT and V . CC 2 Current through pins RF OUT and V . CC 3 T is the temperature at the soldering point of the exposed die pad. case 5. Design support Table 2. Available design support Download from the BGA6130 product page on

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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