X-On Electronics has gained recognition as a prominent supplier of BGA7024,115 RF Amplifier across the USA, India, Europe, Australia, and various other global locations. BGA7024,115 RF Amplifier are a product manufactured by NXP. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

BGA7024,115 NXP

BGA7024,115 electronic component of NXP
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See Product Specifications
Part No.BGA7024,115
Manufacturer: NXP
Category: RF Amplifier
Description: RF Amplifier 2.7GHz 4dB 5V 125mA
Datasheet: BGA7024,115 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 3.2204
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 2.1275
10 : USD 1.8745
100 : USD 1.7365
250 : USD 1.6445
500 : USD 1.4605
1000 : USD 1.219
2000 : USD 1.135
5000 : USD 1.135
10000 : USD 1.1017
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Minimum Operating Temperature
Maximum Operating Temperature
Operating Supply Current
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Product Type
Factory Pack Quantity :
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Mxhts
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We are delighted to provide the BGA7024,115 from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BGA7024,115 and other electronic components in the RF Amplifier category and beyond.

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BGA7024 7 2 6 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Rev. 3 11 June 2014 Product data sheet 1. Product profile 1.1 General description The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount package. It delivers 24 dBm output power at 1 dB gain compression and superior performance up to 2700 MHz. 1.2 Features and benefits 400 MHz to 2700 MHz frequency operating range 16 dB small signal gain at 2 GHz 24 dBm output power at 1 dB gain compression Integrated active biasing External matching allows broad application optimization of the electrical performance 5 V single supply operation All pins ESD protected 1.3 Applications Broadband CPE/MoCA Industrial applications WLAN/ISM/RFID E-metering Wireless infrastructure (base station, Satellite Master Antenna TV (SMATV) repeater, point-to-point backhaul systems) 1.4 Quick reference data Table 1. Quick reference data Input and output impedances matched to 50 . Typical values at V =5V T =25 C CC case unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit supply current 95 110 125 mA I CC 1 400 - 2700 MHz f frequency power gain f = 2140 MHz 13.5 15 16.5 dB G p output power at 1 dB gain compression f = 2140 MHz 24.0 25.5 - dBm P L(1dB) 2 output third-order intercept point f = 2140 MHz 35.0 38.5 - dBm IP3 O 1 Operation outside this range is possible but not guaranteed. 2 P = 11 dBm per tone spacing = 1 MHz. L BGA7024 NXP Semiconductors 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 1V CC(RF) 2 2GND 1 3RF IN P 1 This pin is DC-coupled and requires an external DC-blocking capacitor. 2 The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGA7024 - plastic surface-mounted package exposed die pad for good SOT89 heat transfer 3 leads 4. Functional diagram BIAS V/I BANDGAP ENABLE CONVERTER 3 1 RF IN V CC(RF) 2 GND 014aab020 Fig 1. Functional diagram BGA7024 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 11 June 2014 2 of 23 V

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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