X-On Electronics has gained recognition as a prominent supplier of BGA7027,135 RF Amplifier across the USA, India, Europe, Australia, and various other global locations. BGA7027,135 RF Amplifier are a product manufactured by NXP. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

BGA7027,135 NXP

BGA7027,135 electronic component of NXP
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Part No.BGA7027,135
Manufacturer: NXP
Category: RF Amplifier
Description: RF Amplifier Hi LinearAmp 2700MHz
Datasheet: BGA7027,135 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 3.146 ea
Line Total: USD 3.15 
Availability - 238
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
238
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 3.146
10 : USD 2.893
4000 : USD 2.629

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Type
Operating Frequency
P1dB - Compression Point
Gain
Operating Supply Voltage
NF - Noise Figure
OIP3 - Third Order Intercept
Maximum Operating Temperature
Operating Supply Current
Packaging
Brand
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
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We are delighted to provide the BGA7027,135 from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BGA7027,135 and other electronic components in the RF Amplifier category and beyond.

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BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Rev. 2 26 November 2010 Product data sheet 1. Product profile 1.1 General description The BGA7027 MMIC is a one-stage amplifier, offered in a low-cost surface-mount package. It delivers 28 dBm output power at 1 dB gain compression and a superior performance up to 2700 MHz. 1.2 Features and benefits 400 MHz to 2700 MHz frequency operating range 11 dB small signal gain at 2 GHz 28 dBm output power at 1 dB gain compression Integrated active biasing External matching allows broad application optimization of the electrical performance 5 V single supply operation ESD protection at all pins 1.3 Applications Broadband CPE/MoCA Industrial applications WLAN/ISM/RFID E-metering Wireless infrastructure (base station, Satellite Master Antenna TV (SMATV) repeater, backhaul systems) 1.4 Quick reference data Table 1. Quick reference data Input and output impedances matched to 50 . Typical values at: V =5V T =25 C unless CC case otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1 400 - 2700 MHz f frequency power gain f = 2140 MHz 9.0 11.0 13.0 dB G p output power at 1 dB gain compression f = 2140 MHz 26 28 - dBm P L(1dB) 2 output third-order intercept point f = 2140 MHz 40.0 42.5 - dBm IP3 O 1 Operation outside this range is possible but not guaranteed. 2 P = 17 dBm per tone spacing = 1 MHz. L BGA7027 NXP Semiconductors 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 1V CC(RF) 2 2GND 3 1 1 3RF IN 2 sym130 321 1 This pin is DC-coupled and requires an external DC-blocking capacitor. 2 The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGA7027 - plastic surface-mounted package exposed die pad for good SOT89 heat transfer 3 leads 4. Functional diagram BIAS V/I BANDGAP ENABLE CONVERTER 3 1 V RF IN CC(RF) 2 GND 014aab020 Fig 1. Functional diagram BGA7027 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 26 November 2010 2 of 21

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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