Product Information

BZA100,118

BZA100,118 electronic component of NXP

Datasheet
TVS Diode Arrays DIODE ARRAY TAPE-13
Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

2000: USD 0.338 ea
Line Total: USD 676

0 - Global Stock
MOQ: 2000  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 2000
Multiples : 1
2000 : USD 0.338

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Polarity
Termination Style
Clamping Voltage
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Operating Voltage
Peak Surge Current
Capacitance
Dimensions
Brand
Channels
Mounting Style
Peak Pulse Power Dissipation
Factory Pack Quantity :
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Additional Infomation About Product

DISCRETE SEMICONDUCTORS DATA SHEET M3D184 BZA100 18-fold ESD transient voltage suppressor Product data sheet 1997 Dec 02 Supersedes data of 1996 Mar 21 NXP Semiconductors Product data sheet 18-fold ESD transient voltage BZA100 suppressor FEATURES DESCRIPTION PINNING SO20 SMD package allows 18 18-fold monolitic transient voltage PIN DESCRIPTION separate voltage regulator diodes suppressor. Its 18-fold junction 1 to 5 cathode (k to k ) 1 5 in a common anode configuration common anode design protects 18 6 and 16 common anode (a a ) 1 2 separate lines using only one Working voltage: typ. 6.8 V package. This device is ideal for 7 to 15 cathode (k to k ) 6 14 Forward voltage: max. 1.3 V situations where board space is a 17 to 20 cathode (k to k ) 15 18 Maximum reverse peak power premium. dissipation: 27.5 W at t = 1 ms p Maximum clamping voltage at peak pulse current: 11 V at 2.5 A handbook, 4 columns k k 1 20 1 18 Low leakage current: max. 2 A k k 2 19 2 17 ESD rating >8 kV, according k k IEC 801-2. 3 18 3 16 20 19 18 17 16 15 14 13 12 11 k k 4 4 17 15 APPLICATIONS k a 5 5 16 2 SO20 Where transient overvoltage a k 1 6 15 14 protection in voltage and ESD k k 6 7 14 13 sensitive equipment is required 1 2 3 4 5 6 7 8 9 10 such as: k k 8 13 7 12 MBG396 Computers k k 9 12 8 11 Printers k k 10 11 9 10 Business machines Communication systems Fig.1 Pin configuration for SO20 (SOT163-1) and symbol. Medical equipment. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT I working current note 1 mA Z I continuous forward current 200 mA F I non-repetitive peak forward current t = 1 ms square pulse 4 A FSM p I non-repetitive peak reverse current t = 1 ms square pulse see Fig.2 2.5 A ZSM p P total power dissipation see Fig.3 tot up to T = 60 C note 2 1.6 W s up to T = 25 C note 3 1.25 W amb P non-repetitive peak reverse power t = 1 ms square pulse see Fig.4 27.5 W ZSM p dissipation T storage temperature 65 +150 C stg T operating junction temperature 150 C j Notes 1. DC working current limited by P . tot max 2. One or more diodes loaded T is the temperature at the soldering point. s 3. One or more diodes loaded device mounted on a printed-circuit board with R = 43.5 K/W. th a-s 1997 Dec 02 2

HS Compliance

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS

NXP may also be referenced as

FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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