DEVKIT-MOTORGD NXP

Document Number MPC5744P NXP Semiconductors Rev. 6.1, 11/2017 Data Sheet: Technical Data MPC5744P MPC5744P Data Sheet 32-bit MCU suitable for ISO26262 ASIL- D chassis and safety applications Features This document provides electrical specifications, pin assignments, and package diagram information for the The MPC5744P microcontroller is based on the Power MPC5744P series of microcontroller units (MCUs). Architecture developed by NXP. It targets chassis For functional characteristics and the programming and safety applications and other applications requiring model, see the MPC5744P Reference Manual. a high Automotive Safety Integrity Level (ASIL). The MPC5744P is a SafeAssure solution. Junction temperature: The upper limit is 150C or 165C depending on the device marking. NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Introduction.......................................................................................... 3 3.12 Main oscillator electrical characteristics................................... 69 1.1 Features......................................................................................3 3.13 PLLDIG electrical characteristics............................................. 72 1.2 Block Diagram...........................................................................5 3.14 16 MHz Internal RC Oscillator (IRCOSC) electrical 2 Pinouts..................................................................................................6 specifications............................................................................. 73 2.1 Package pinouts and ballmap.................................................... 6 3.15 ADC electrical characteristics................................................... 74 2.2 Pin/ball descriptions ................................................................. 8 3.16 Flash memory specifications..................................................... 77 2.2.1 Pin/ball startup and reset states................................. 8 3.16.1 Maximum junction temperature 150C.....................77 2.2.2 Power supply and reference voltage pins/balls......... 9 3.16.2 Maximum junction temperature 165C.....................80 2.2.3 System pins/balls.......................................................12 3.16.3 Flash memory read wait-state and address-pipeline 2.2.4 LVDS pins/balls........................................................13 control settings.......................................................... 84 2.2.5 Generic pins/balls......................................................14 3.17 SGEN electrical characteristics................................................. 85 2.2.6 Peripheral input muxing............................................43 3.18 RESET sequence duration.........................................................86 3 Electrical characteristics.......................................................................55 3.19 AC specifications.......................................................................86 3.1 Introduction............................................................................... 55 3.19.1 Reset pad (EXT POR, RESET) electrical 3.2 165C junction temperature option........................................... 55 characteristics............................................................87 3.3 Absolute maximum ratings....................................................... 55 3.19.2 WKUP/NMI timing...................................................89 3.4 Recommended operating conditions......................................... 57 3.19.3 Debug/JTAG/Nexus/Aurora timing..........................89 3.5 Thermal characteristics..............................................................58 3.19.4 External interrupt timing (IRQ pin).......................... 96 3.5.1 General notes for specifications at maximum 3.19.5 SPI timing................................................................. 97 junction temperature................................................. 59 3.19.6 LFAST...................................................................... 102 3.6 Electromagnetic compatibility (EMC)...................................... 60 3.19.7 FlexRay..................................................................... 106 3.7 Electrostatic discharge (ESD) characteristics............................62 3.19.8 Ethernet switching specifications..............................109 3.8 Voltage regulator electrical characteristics............................... 62 4 Obtaining package dimensions.............................................................111 3.9 DC electrical characteristics......................................................65 5 Ordering information............................................................................112 3.10 Supply current characteristics....................................................67 6 Document revision history................................................................... 113 3.11 Temperature sensor................................................................... 69 MPC5744P Data Sheet, Rev. 6.1, 11/2017 2 NXP Semiconductors