NXP Semiconductors Document Number: MC10XS4200 Rev. 7.0, 5/2018 Data Sheet: Advance Information Dual 24 V, 10 mOhm high-side switch 10XS4200 The 10XS4200 device is part of a 24 V dual high-side switch product family with integrated control, and a high number of protective and diagnostic functions. It has been designed for truck, bus, and industrial applications. The low R DS(ON) channels (<10 m) can control different load types bulbs, solenoids, or DC motors. Control, device configuration, and diagnostics are performed through a HIGH-SIDE SWITCH 16-bit serial peripheral interface (SPI), allowing easy integration into existing applications. This device is powered by SMARTMOS technology. Both channels can be controlled individually by external or internal clock signals, or by direct inputs. Using the internal clock allows fully autonomous device operation. Programmable output voltage slew-rates (individually programmable) helps improve electromagnetic compatibility (EMC) performance. To avoid shutting off the device upon inrush current, while still being able to closely track the load current, a dynamic overcurrent threshold profile is featured. Switching current of each channel can be sensed with a programmable sensing ratio. Whenever communication with the external microcontroller is lost, the device enters a Fail-safe operation mode, but remains operational, controllable, and protected. FK SUFFIX (PB-FREE) Features 98ASA00428D 23 PIN PQFN (12 X12 mm) Two fully protected 10 m ( 25 C) high side switches Up to 8.5 A steady state current per channel Separate bulb and DC motor latched overcurrent handling Individually programmable internal/external PWM clock signals Overcurrent, short-circuit, and overtemperature protection with programmable autoretry functions Accurate temperature and current sensing Openload detection (channel in OFF and ON state), also for LED applications (7.0 mA typ.) Normal operating range: 8.0 to 36 V, extended range: 6.0 to 58 V 3.3 V and 5.0 V compatible 16-bit SPI port for device control, configuration and diagnostics at rates up to 8.0 MHz V V V DD DD PWR 10XS4200 VDD VPWR I/O CLOCK I/O FSB SCLK SCLK HS0 CSB CSB LOAD SI SO MCU I/O RSTB SO SI HS1 I/O IN0 LOAD M I/O IN1 CONF0 CONF1 I/O FSOB A/D SYNC A/D CSNS GND GND Figure 1. Simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. NXP B.V. 2018.Table of Contents 1 Orderable parts 3 2 Internal block diagram . 4 3 Pin assignment 5 4 Electrical characteristics . 7 4.1 Maximum ratings . 7 4.2 Static electrical characteristics 8 4.4 Timing diagrams 23 5 Functional description 26 5.1 Introduction 26 5.2 Pin assignment and functions 26 5.3 Functional internal block description . 29 6 Functional device operation 30 6.1 Operation and operating modes 30 6.3 Logic commands and SPI registers . 49 7 Typical applications 59 8 Packaging . 61 8.2 Package dimensions . 62 9 Revision history . 70 10XS4200 NXP Semiconductors 2