MC13201FCR2 NXP

Document Number: MC13201 Freescale Semiconductor, Inc. Rev. 2, 04/2015 Datasheet: Technical Data MC13201 Datasheet with Addendum Rev. 2 of the MC13201 datasheet has two parts: The addendum to revision 1.3 of the datasheet immediately following this cover page. Revision 1.3 of the datasheet, following the addendum. The changes described in the addendum have not been implemented in the specified pages. 2015 Freescale Semiconductor, Inc. All rights reserved.Freescale Semiconductor, Inc. Document Number: MC13201AD Datasheet Addendum Rev. 0, 04/2015 Addendum to Rev. 1.3 of the MC13201 Datasheet This addendum identifies changes to Rev. 1.3 of the MC13201 datasheet. The changes described in this addendum have not been implemented in the specified pages. 1 Case outline drawing change for new QFN-32 package migration Location: Section 9, Page 27 The case outline was change d because of migration from gold wire to copper wire for QFN-32 packages. The case outline details in Section 9 Packaging Information, should be replaced with package document 98ASA00473D case outline details. To view the new case outline details, go to freescale.com and perform a keyword search for the drawings document number. If you want the drawing for this package Then use this document number QFN-32 98ASA00473D NOTE For more information about QFN package use, see EB806 Electrical Connection Recommendations for Exposed Pad on QFN and DFN Packages. 2015 Freescale Semiconductor, Inc. All rights reserved.