NXP Semiconductors Document Number: CD1030 Rev. 5.0, 7/2018 Technical Data 33 channel multiple switch detection CD1030 interface with programmable wetting current MULTIPLE SWITCH DETECTION INTERFACE The CD1030 is designed to detect the closing and opening of up to 33 switch contacts. The switch status, either open or closed, is transferred to the microprocessor unit (MCU) through a serial peripheral interface (SPI). This SMARTMOS device also features a 35-to-1 analog multiplexer for reading the input channels as analog inputs. The analog selected input signal is buffered and provided on the AMUX output pin for the MCU to read. Independent programmable wetting currents are available as needed for the application. A battery and temperature monitor are included in the IC and AE SUFFIX (PB-FREE) available via the AMUX pin. 98ASA00173D The CD1030 device has two modes of operation, Normal and Low-power mode 48-PIN LQFP-EP (LPM). Normal mode allows programming of the device and supplies switch contacts with pull-up or pull-down current as it monitors the change of state on Applications the switches. The LPM provides low quiescent current, which makes the Automotive CD1030 ideal for automotive and industrial products requiring low sleep-state Heating ventilation and air conditioning (HVAC) currents. Lighting Features Central gateway / in-vehicle networking Fully functional operation 4.5 V V 36 V Gasoline engine management BATP Full parametric operation 6.0 V V 28 V Industrial BATP Operating switch input voltage range from -1.0 V to 36 V Programmable logic control (PLC) 12 programmable inputs (switches to battery or ground) Process control, temperature control 21 switch-to-ground inputs Input-output control (I/O Control) Selectable wetting current (2.0, 6.0, 8.0, 10, 12, 14, 16, or 20 mA) Single board computer Interfaces directly to an MCU using 3.3 V / 5.0 V SPI protocol Ethernet switch Selectable wake-up on change of state Typical standby current I = 50 A and I = 10 A BATP DDQ Active interrupt (INT B) on switch state change Integrated battery and temperature sensing V DDQ Battery Power Supply CD1030 SG1 Battery VBATP SP0 Power WAKE B Supply MCU SP1 VDDQ INT B INTB SP11 CS B CSB MISO MISO MOSI MOSI SCLK SCLK SG0 AN0 AMUX SG1 SG20 EP GND Figure 1. CD1030 simplified application diagram NXP B.V. 2018.Table of Contents 1 Orderable parts 3 2 Internal block diagram . 4 3 Pin connections 5 3.1 Pinout . 5 3.2 Pin definitions . 5 4 General product characteristics 7 4.1 Maximum ratings . 7 4.2 Thermal characteristics 8 4.3 Operating conditions 9 4.4 Electrical characteristics 10 5 General description 19 5.1 Features 19 5.2 Functional block diagram . 20 6 General IC functional description 21 6.1 Battery voltage ranges . 21 6.2 Power sequencing conditions 22 6.3 Low-power mode operation 24 7 Functional block description . 27 7.1 State machine 27 7.2 Input functional block 28 7.3 Oscillator and timer control functional block . 30 7.4 Temperature monitor and control functional block 30 7.5 WAKE B control functional block . 30 7.6 INT B functional block . 30 7.7 AMUX functional block . 31 7.8 Serial peripheral interface (SPI) 32 7.9 SPI control register definition 35 8 Typical applications 60 8.1 Application diagram 60 8.2 Bill of materials . 60 8.3 Abnormal operation 61 9 Packaging . 62 9.1 Package mechanical dimensions . 62 10 Reference section . 65 11 Revision history . 66 CD1030 Analog Integrated Circuit Device Data NXP Semiconductors 2