MC33CM0902WEF NXP

NXP Semiconductors Document Number: CM0902 Rev. 4.0, 8/2016 Data Sheet: Advance Information Dual high-speed CAN transceiver CM0902 The CM0902 is a SMARTMOS dual high-speed (up to 1.0 Mbit/s) CAN transceiver device, providing the physical interface between the CAN protocol controller of an MCU and the physical dual wire CAN bus. Both channels are completely independent, featuring CAN bus wake-up on each CAN interface, CAN HIGH-SPEED TRANSCEIVER and TXD dominant timeout functionality (33CM0902 only). The CM0902 is packaged in a 14-pin SOIC, with industry standard pin out, and offers excellent EMC and ESD performance without the need for external filter components.The CM0902 comes in two variants: 33CM0902 and 34CM0902 for Automotive and Industrial applications respectively. Features EF SUFFIX (PB-FREE) 98ASB42565B Very low-current consumption in standby mode 14-PIN SOICN Compatible with +3.3 V or +5.0 V MCU interface Standby mode with remote CAN wake-up Pin and function compatible with market standard Automotive applications (33CM0902) Cost efficient robustness: Supports automotive CAN high-speed applications Body electronics High system level ESD performance Power train Very high electromagnetic immunity and low electromagnetic emission without common mode choke or other external components. Chassis and safety Infotainment Fail-safe behaviors: Diagnostic equipment TXD Dominant timeout (33CM0902 only) Accessories Ideal passive behavior when unpowered, CAN bus leakage current Industrial applications (34CM0902) <10 A. Transportation V and V monitoring DD IO Backplanes Lift/elevators Factory automation Industrial process control CM0902 VREG 5.0 V 5.0 V VDD 3.3 V VIO V PWR CAN H1 MCU CAN1 BUS 3.3 V VCC STB1 CAN L1 I/O CAN1 TX TXD1 protocol RX controller RXD1 STB2 I/O CAN H2 CAN2 TX TXD2 CAN2 BUS protocol RX controller RXD2 CAN L2 GND Figure 1. Simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. 2016 NXP B.V.Table of Contents 1 Orderable parts 3 2 Internal block diagram . 4 3 Pin connections 5 3.1 Pinout 5 3.2 Pin definitions 5 4 General product characteristics 6 4.1 Maximum ratings . 6 4.2 Thermal characteristics 7 4.3 Electrical characteristics 7 4.4 Operating conditions 13 5 General IC functional description and application information 14 5.1 Features . 14 5.2 Functional Block Diagram 15 5.3 Functional description . 15 6 Functional operation . 17 6.1 Operating modes 17 6.2 Fail-safe mechanisms . 17 6.3 Device operation summary . 19 7 Typical applications 20 7.1 Application diagrams . 20 8 Packaging . 22 8.1 Package mechanical dimensions 22 9 Revision history . 24 CM0902 NXP Semiconductors 2