MC56F82623VLC

Document Number MC56F826XXDS NXP Semiconductors Rev. 0, 08/2018 Data Sheet: Technical Data MC56F826XXDS MC56F826xx Supports MC56F82646VLF, MC56F82643VLC, MC56F82623VLC Features Timers One 16-bit quad timer (1 x 4 16-bit timer) This family of digital signal controllers (DSCs) is Two Periodic Interval Timers (PITs) based on the 32-bit 56800EX core. On a single chip, each device combines the processing power of a DSP Security and integrity and the functionality of an MCU, with a flexible set of Cyclic Redundancy Check (CRC) generator peripherals to support many target applications: Windowed Computer operating properly (COP) Industrial control watchdog Home appliances External Watchdog Monitor (EWM) Motor control (ACIM, BLDC, PMSM, SR, stepper) Clocks DSC based on 32-bit 56800EX core Two on-chip relaxation oscillators: 8 MHz (400 kHz Up to 100 MIPS at 100 MHz core frequency in fast at standby mode) and 200 kHz mode Crystal / resonator oscillator DSP and MCU functionality in a unified, C-efficient System architecture DMA controller On-chip memory Integrated power-on reset (POR) and low-voltage Up to 64 KB flash memory interrupt (LVI) and brown-out reset module 8 KB data/program RAM Inter-module crossbar connection On-chip flash memory and RAM can be mapped JTAG/enhanced on-chip emulation (EOnCE) for into both program and data memory spaces unobtrusive, real-time debugging Analog Operating characteristics Two high-speed, 5-channel, 12-bit ADCs with Single supply: 3.0 V to 3.6 V dynamic x1, x2, and x4 programmable amplifier 5 Vtolerant I/O (except for RESETB pin which is a Four analog comparators with integrated 6-bit DAC 3.3 V pin only) references Operation ambient temperature: V temperature option: -40C to 105C One FlexPWM module with up to 6 PWM outputs 48-pin LQFP, and 32-pin LQFP packages Communication interfaces Up to two high-speed queued SCI (QSCI) modules with LIN slave functionality NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Overview............................................................................................3 6.1 Thermal handling ratings........................................................ 25 1.1 MC56F826xx Product Family.................................................3 6.2 Moisture handling ratings........................................................25 1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........3 6.3 ESD handling ratings.............................................................. 25 1.3 Operation Parameters.............................................................. 4 6.4 Voltage and current operating ratings..................................... 26 1.4 On-Chip Memory and Memory Protection............................. 5 7 General............................................................................................... 27 1.5 Interrupt Controller................................................................. 5 7.1 General characteristics............................................................ 27 1.6 Peripheral highlights............................................................... 6 7.2 AC electrical characteristics....................................................28 1.7 Block diagrams........................................................................10 7.3 Nonswitching electrical specifications....................................29 2 MC56F826xx signal and pin descriptions..........................................13 7.4 Switching specifications..........................................................35 2.1 Signal groups...........................................................................18 7.5 Thermal specifications............................................................ 36 3 Ordering parts.....................................................................................19 8 Peripheral operating requirements and behaviors..............................37 3.1 Determining valid orderable parts...........................................19 8.1 Core modules...........................................................................37 4 Part identification...............................................................................19 8.2 System modules.......................................................................38 4.1 Description.............................................................................. 19 8.3 Clock modules.........................................................................39 4.2 Format..................................................................................... 19 8.4 Memories and memory interfaces........................................... 41 4.3 Fields....................................................................................... 19 8.5 Analog..................................................................................... 43 4.4 Example...................................................................................20 8.6 Timer....................................................................................... 48 5 Terminology and guidelines...............................................................20 8.7 Communication interfaces.......................................................49 5.1 Definition: Operating requirement.......................................... 20 9 Design Considerations....................................................................... 50 5.2 Definition: Operating behavior............................................... 21 9.1 Thermal design considerations................................................50 5.3 Definition: Attribute................................................................21 9.2 Electrical design considerations.............................................. 51 5.4 Definition: Rating....................................................................21 9.3 Power-on Reset design considerations....................................53 5.5 Result of exceeding a rating.................................................... 22 10 Obtaining package dimensions.......................................................... 55 5.6 Relationship between ratings and operating requirements......22 11 Pinout................................................................................................. 55 5.7 Guidelines for ratings and operating requirements................. 23 11.1 Signal Multiplexing and Pin Assignments..............................55 5.8 Definition: Typical value........................................................ 23 11.2 Pinout diagrams.......................................................................57 5.9 Typical value conditions......................................................... 24 12 Product documentation.......................................................................59 6 Ratings................................................................................................25 MC56F826xx, Rev. 0, 08/2018 2 NXP Semiconductors