X-On Electronics has gained recognition as a prominent supplier of MC56F82646VLF Digital Signal Processors & Controllers - DSP, DSC across the USA, India, Europe, Australia, and various other global locations. MC56F82646VLF Digital Signal Processors & Controllers - DSP, DSC are a product manufactured by NXP. We provide cost-effective solutions for Digital Signal Processors & Controllers - DSP, DSC, ensuring timely deliveries around the world.

MC56F82646VLF NXP

MC56F82646VLF electronic component of NXP
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Part No.MC56F82646VLF
Manufacturer: NXP
Category: Digital Signal Processors & Controllers - DSP, DSC
Description: Digital Signal Processors & Controllers - DSP, DSC ANGUILLA SILVER B0,48LQF
Datasheet: MC56F82646VLF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.6501 ea
Line Total: USD 1.65 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Tue. 19 Nov to Thu. 21 Nov
MOQ : 1
Multiples : 1
1 : USD 6.9106
10 : USD 3.9235
250 : USD 3.6671
500 : USD 3.4999
1000 : USD 3.3662
2500 : USD 3.2547

   
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We are delighted to provide the MC56F82646VLF from our Digital Signal Processors & Controllers - DSP, DSC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MC56F82646VLF and other electronic components in the Digital Signal Processors & Controllers - DSP, DSC category and beyond.

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Document Number MC56F826XXDS NXP Semiconductors Rev. 0, 08/2018 Data Sheet: Technical Data MC56F826XXDS MC56F826xx Supports MC56F82646VLF, MC56F82643VLC, MC56F82623VLC Features Timers One 16-bit quad timer (1 x 4 16-bit timer) This family of digital signal controllers (DSCs) is Two Periodic Interval Timers (PITs) based on the 32-bit 56800EX core. On a single chip, each device combines the processing power of a DSP Security and integrity and the functionality of an MCU, with a flexible set of Cyclic Redundancy Check (CRC) generator peripherals to support many target applications: Windowed Computer operating properly (COP) Industrial control watchdog Home appliances External Watchdog Monitor (EWM) Motor control (ACIM, BLDC, PMSM, SR, stepper) Clocks DSC based on 32-bit 56800EX core Two on-chip relaxation oscillators: 8 MHz (400 kHz Up to 100 MIPS at 100 MHz core frequency in fast at standby mode) and 200 kHz mode Crystal / resonator oscillator DSP and MCU functionality in a unified, C-efficient System architecture DMA controller On-chip memory Integrated power-on reset (POR) and low-voltage Up to 64 KB flash memory interrupt (LVI) and brown-out reset module 8 KB data/program RAM Inter-module crossbar connection On-chip flash memory and RAM can be mapped JTAG/enhanced on-chip emulation (EOnCE) for into both program and data memory spaces unobtrusive, real-time debugging Analog Operating characteristics Two high-speed, 5-channel, 12-bit ADCs with Single supply: 3.0 V to 3.6 V dynamic x1, x2, and x4 programmable amplifier 5 Vtolerant I/O (except for RESETB pin which is a Four analog comparators with integrated 6-bit DAC 3.3 V pin only) references Operation ambient temperature: V temperature option: -40C to 105C One FlexPWM module with up to 6 PWM outputs 48-pin LQFP, and 32-pin LQFP packages Communication interfaces Up to two high-speed queued SCI (QSCI) modules with LIN slave functionality NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Overview............................................................................................3 6.1 Thermal handling ratings........................................................ 25 1.1 MC56F826xx Product Family.................................................3 6.2 Moisture handling ratings........................................................25 1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........3 6.3 ESD handling ratings.............................................................. 25 1.3 Operation Parameters.............................................................. 4 6.4 Voltage and current operating ratings..................................... 26 1.4 On-Chip Memory and Memory Protection............................. 5 7 General............................................................................................... 27 1.5 Interrupt Controller................................................................. 5 7.1 General characteristics............................................................ 27 1.6 Peripheral highlights............................................................... 6 7.2 AC electrical characteristics....................................................28 1.7 Block diagrams........................................................................10 7.3 Nonswitching electrical specifications....................................29 2 MC56F826xx signal and pin descriptions..........................................13 7.4 Switching specifications..........................................................35 2.1 Signal groups...........................................................................18 7.5 Thermal specifications............................................................ 36 3 Ordering parts.....................................................................................19 8 Peripheral operating requirements and behaviors..............................37 3.1 Determining valid orderable parts...........................................19 8.1 Core modules...........................................................................37 4 Part identification...............................................................................19 8.2 System modules.......................................................................38 4.1 Description.............................................................................. 19 8.3 Clock modules.........................................................................39 4.2 Format..................................................................................... 19 8.4 Memories and memory interfaces........................................... 41 4.3 Fields....................................................................................... 19 8.5 Analog..................................................................................... 43 4.4 Example...................................................................................20 8.6 Timer....................................................................................... 48 5 Terminology and guidelines...............................................................20 8.7 Communication interfaces.......................................................49 5.1 Definition: Operating requirement.......................................... 20 9 Design Considerations....................................................................... 50 5.2 Definition: Operating behavior............................................... 21 9.1 Thermal design considerations................................................50 5.3 Definition: Attribute................................................................21 9.2 Electrical design considerations.............................................. 51 5.4 Definition: Rating....................................................................21 9.3 Power-on Reset design considerations....................................53 5.5 Result of exceeding a rating.................................................... 22 10 Obtaining package dimensions.......................................................... 55 5.6 Relationship between ratings and operating requirements......22 11 Pinout................................................................................................. 55 5.7 Guidelines for ratings and operating requirements................. 23 11.1 Signal Multiplexing and Pin Assignments..............................55 5.8 Definition: Typical value........................................................ 23 11.2 Pinout diagrams.......................................................................57 5.9 Typical value conditions......................................................... 24 12 Product documentation.......................................................................59 6 Ratings................................................................................................25 MC56F826xx, Rev. 0, 08/2018 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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