Document Number MCF51JU128 Freescale Semiconductor Rev. 5, 03/2015 Data Sheet: Technical Data MCF51JU128 MCF51JU128 Supports the MCF51JU128VLH, MCF51JU128VHS, MCF51JU64VLF, MCF51JU64VHS, MCF51JU32VHS, MCF51JU32VFM Features Analog 12-bit SAR ADC Operating characteristics 12-bit DAC Voltage range: 1.71 V to 3.6 V Analog comparator (CMP) containing a 6-bit DAC Flash write voltage range: 1.71 V to 3.6 V and programmable reference input Temperature range (ambient): -40C to 105C Voltage reference (VREF) Core Timers Up to 50 MHz V1 ColdFire CPU Programmable delay block (PDB) Dhrystone 2.1 performance: 1.10 DMIPS per MHz Motor control/general purpose/PWM timers (FTM) when executing from internal RAM, 0.99 DMIPS 16-bit low-power timers (LPTMRs) per MHz when executing from flash memory 16-bit modulo timer (MTIM) System Carrier modulator transmitter (CMT) DMA controller with four programmable channels Communication interfaces Integrated ColdFire DEBUG Rev B+ interface with UARTs with Smart Card support and FIFO single-wire BDM connection SPI modules, one with FIFO Power management Inter-Integrated Circuit (I2C) modules 10 low power modes to provide power optimization USB full/low speed On-the-Go controller with on- based on application requirements chip transceiver Low-leakage wakeup unit (LLWU) Integrated Interchip Sound (I2S) / Serial Audio Voltage regulator (VREG) Interface (SAI) to support full-duplex serial interfaces with frame sync such as AC97 and Clocks CODEC Crystal oscillators (two, each with range options): 1 kHz to 32 kHz (low), 1 MHz to 8 MHz (medium), 8 Human-machine interface MHz to 32 MHz (high) Up to 48 EGPIO pins Multipurpose clock generator (MCG) Up to 16 rapid general purpose I/O (RGPIO) pins Low-power hardware touch sensor interface (TSI) Memories and memory interfaces Interrupt request pin (IRQ) Flash memory, FlexNVM, FlexRAM, and RAM Serial programming interface (EzPort) Mini-FlexBus external bus interface Security and integrity Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip 20102015 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts.......................................................................................3 5.4.1 Thermal operating requirements.................................... 20 1.1 Determining valid orderable parts............................................... 3 5.4.2 Thermal attributes.......................................................... 20 2 Part identification................................................................................. 3 6 Peripheral operating requirements and behaviors................................ 21 2.1 Description...................................................................................3 6.1 Core modules............................................................................... 21 2.2 Format..........................................................................................3 6.1.1 Debug specifications...................................................... 21 2.3 Fields............................................................................................3 6.2 System modules........................................................................... 21 2.4 Example....................................................................................... 4 6.3 Clock modules............................................................................. 21 3 Terminology and guidelines.................................................................4 6.3.1 MCG specifications........................................................21 3.1 Definition: Operating requirement...............................................4 6.3.2 Oscillator electrical specifications................................. 23 3.2 Definition: Operating behavior....................................................4 6.4 Memories and memory interfaces................................................26 3.3 Definition: Attribute.................................................................... 5 6.4.1 Flash electrical specifications........................................ 26 3.4 Definition: Rating........................................................................ 5 6.4.2 EzPort Switching Specifications....................................29 3.5 Result of exceeding a rating.........................................................6 6.4.3 Mini-Flexbus Switching Specifications......................... 30 3.6 Relationship between ratings and operating requirements.......... 6 6.5 Security and integrity modules.................................................... 32 3.7 Guidelines for ratings and operating requirements......................6 6.6 Analog..........................................................................................33 3.8 Definition: Typical value............................................................. 7 6.6.1 ADC electrical specifications.........................................33 4 Ratings..................................................................................................8 6.6.2 CMP and 6-bit DAC electrical specifications................36 4.1 Thermal handling ratings............................................................. 8 6.6.3 12-bit DAC electrical characteristics............................. 38 4.2 Moisture handling ratings............................................................ 8 6.6.4 Voltage reference electrical specifications.....................41 4.3 ESD handling ratings................................................................... 8 6.7 Timers.......................................................................................... 42 4.4 Voltage and current operating ratings..........................................8 6.8 Communication interfaces........................................................... 42 5 General................................................................................................. 9 6.8.1 USB electrical specifications......................................... 42 5.1 Typical Value Conditions............................................................ 9 6.8.2 USB DCD electrical specifications................................43 5.2 Nonswitching electrical specifications........................................ 9 6.8.3 USB VREG electrical specifications............................. 43 5.2.1 Voltage and Current Operating Requirements...............9 6.8.4 SPI switching specifications.......................................... 44 5.2.2 LVD and POR operating requirements..........................10 6.8.5 I2S/SAI Switching Specifications..................................47 5.2.3 Voltage and current operating behaviors....................... 11 6.9 Human-machine interfaces (HMI)...............................................49 5.2.4 Power mode transition operating behaviors...................12 6.9.1 TSI electrical specifications........................................... 49 5.2.5 Power consumption operating behaviors....................... 13 7 Dimensions...........................................................................................50 5.2.6 EMC radiated emissions operating behaviors................16 7.1 Obtaining package dimensions.................................................... 50 5.2.7 Designing with radiated emissions in mind................... 17 8 Pinout................................................................................................... 50 5.2.8 Capacitance attributes.................................................... 17 8.1 Signal Multiplexing and Pin Assignments...................................50 5.3 Switching electrical specifications...............................................17 8.2 Pinout diagrams........................................................................... 53 5.3.1 General Switching Specifications.................................. 18 8.3 Module-by-module signals.......................................................... 57 5.4 Thermal specifications.................................................................20 9 Revision History...................................................................................67 MCF51JU128, Rev. 5, 03/2015 2 Freescale Semiconductor, Inc.