MCF51QM128VLH NXP

Document Number MCF51QM128 Freescale Semiconductor Rev. 7, 03/2015 Data Sheet: Technical Data MCF51QM128 MCF51QM128 Supports the MCF51QM128VLH, MCF51QM128VHS, MCF51QM64VLF, MCF51QM64VHS, MCF51QM32VHS, MCF51QM32VFM Features Security and integrity Hardware CRC module to support fast cyclic Operating characteristics redundancy checks Voltage range: 1.71 V to 3.6 V Hardware random number generator (RNGB) Flash write voltage range: 1.71 V to 3.6 V Hardware cryptographic acceleration unit (CAU) Temperature range (ambient): -40C to 105C 128-bit unique identification (ID) number per chip Core Analog Up to 50 MHz V1 ColdFire CPU 16-bit SAR ADC Dhrystone 2.1 performance: 1.10 DMIPS per MHz 12-bit DAC when executing from internal RAM, 0.99 DMIPS Analog comparator (CMP) containing a 6-bit DAC per MHz when executing from flash memory and programmable reference input System Voltage reference (VREF) DMA controller with four programmable channels Timers Integrated ColdFire DEBUG Rev B+ interface with Programmable delay block (PDB) single-wire BDM connection Motor control/general purpose/PWM timers (FTM) Power management 16-bit low-power timers (LPTMRs) 10 low power modes to provide power optimization 16-bit modulo timer (MTIM) based on application requirements Carrier modulator transmitter (CMT) Low-leakage wakeup unit (LLWU) Communication interfaces Voltage regulator (VREG) UARTs with Smart Card support and FIFO Clocks SPI modules, one with FIFO Crystal oscillators (two, each with range options): 1 Inter-Integrated Circuit (I2C) modules kHz to 32 kHz (low), 1 MHz to 8 MHz (medium), 8 Human-machine interface MHz to 32 MHz (high) Up to 48 EGPIO pins Multipurpose clock generator (MCG) Up to 16 rapid general purpose I/O (RGPIO) pins Memories and memory interfaces Low-power hardware touch sensor interface (TSI) Flash memory, FlexNVM, FlexRAM, and RAM Interrupt request pin (IRQ) Serial programming interface (EzPort) Mini-FlexBus external bus interface 20102015 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts.......................................................................................3 5.4 Thermal specifications.................................................................20 1.1 Determining valid orderable parts............................................... 3 5.4.1 Thermal operating requirements.................................... 20 2 Part identification................................................................................. 3 5.4.2 Thermal attributes.......................................................... 20 2.1 Description...................................................................................3 6 Peripheral operating requirements and behaviors................................ 21 2.2 Format..........................................................................................3 6.1 Core modules............................................................................... 21 2.3 Fields............................................................................................3 6.1.1 Debug specifications...................................................... 21 2.4 Example....................................................................................... 4 6.2 System modules........................................................................... 21 3 Terminology and guidelines.................................................................4 6.2.1 VREG electrical specifications...................................... 21 3.1 Definition: Operating requirement...............................................4 6.3 Clock modules............................................................................. 22 3.2 Definition: Operating behavior....................................................4 6.3.1 MCG specifications........................................................22 3.3 Definition: Attribute.................................................................... 5 6.3.2 Oscillator electrical specifications................................. 24 3.4 Definition: Rating........................................................................ 5 6.4 Memories and memory interfaces................................................26 3.5 Result of exceeding a rating.........................................................6 6.4.1 Flash electrical specifications........................................ 26 3.6 Relationship between ratings and operating requirements.......... 6 6.4.2 EzPort Switching Specifications....................................29 3.7 Guidelines for ratings and operating requirements......................6 6.4.3 Mini-Flexbus Switching Specifications......................... 30 3.8 Definition: Typical value............................................................. 7 6.5 Security and integrity modules.................................................... 33 4 Ratings..................................................................................................8 6.6 Analog..........................................................................................34 4.1 Thermal handling ratings............................................................. 8 6.6.1 ADC electrical specifications.........................................34 4.2 Moisture handling ratings............................................................ 8 6.6.2 CMP and 6-bit DAC electrical specifications................38 4.3 ESD handling ratings................................................................... 8 6.6.3 12-bit DAC electrical characteristics............................. 40 4.4 Voltage and current operating ratings..........................................8 6.6.4 Voltage reference electrical specifications.....................43 5 General................................................................................................. 9 6.7 Timers.......................................................................................... 44 5.1 Typical Value Conditions............................................................ 9 6.8 Communication interfaces........................................................... 45 5.2 Nonswitching electrical specifications........................................ 9 6.8.1 SPI switching specifications.......................................... 45 5.2.1 Voltage and Current Operating Requirements...............9 6.9 Human-machine interfaces (HMI)...............................................48 5.2.2 LVD and POR operating requirements..........................10 6.9.1 TSI electrical specifications........................................... 48 5.2.3 Voltage and current operating behaviors....................... 11 7 Dimensions...........................................................................................49 5.2.4 Power mode transition operating behaviors...................12 7.1 Obtaining package dimensions.................................................... 49 5.2.5 Power consumption operating behaviors....................... 12 8 Pinout................................................................................................... 50 5.2.6 EMC radiated emissions operating behaviors................16 8.1 Signal Multiplexing and Pin Assignments...................................50 5.2.7 Designing with radiated emissions in mind................... 17 8.2 Pinout diagrams........................................................................... 52 5.2.8 Capacitance attributes.................................................... 17 8.3 Module-by-module signals.......................................................... 56 5.3 Switching electrical specifications...............................................17 9 Revision History...................................................................................65 5.3.1 General Switching Specifications.................................. 18 MCF51QM128, Rev. 7, 03/2015 2 Freescale Semiconductor, Inc.