Document Number MCF51QU128 Freescale Semiconductor Rev. 5, 03/2015 Data Sheet: Technical Data MCF51QU128 MCF51QU128 Supports the MCF51QU128VLH, MCF51QU128VHS, MCF51QU64VLF, MCF51QU64VHS, MCF51QU32VHS, MCF51QU32VFM Features Security and integrity Hardware CRC module to support fast cyclic Operating characteristics redundancy checks Voltage range: 1.71 V to 3.6 V 128-bit unique identification (ID) number per chip Flash write voltage range: 1.71 V to 3.6 V Temperature range (ambient): -40C to 105C Analog 12-bit SAR ADC Core 12-bit DAC Up to 50 MHz V1 ColdFire CPU Analog comparator (CMP) containing a 6-bit DAC Dhrystone 2.1 performance: 1.10 DMIPS per MHz and programmable reference input when executing from internal RAM, 0.99 DMIPS Voltage reference (VREF) per MHz when executing from flash memory Timers System Programmable delay block (PDB) DMA controller with four programmable channels Motor control/general purpose/PWM timers (FTM) Integrated ColdFire DEBUG Rev B+ interface with 16-bit low-power timers (LPTMRs) single-wire BDM connection 16-bit modulo timer (MTIM) Power management Carrier modulator transmitter (CMT) 10 low power modes to provide power optimization Communication interfaces based on application requirements UARTs with Smart Card support and FIFO Low-leakage wakeup unit (LLWU) SPI modules, one with FIFO Voltage regulator (VREG) Inter-Integrated Circuit (I2C) modules Clocks Human-machine interface Crystal oscillators (two, each with range options): 1 Up to 48 EGPIO pins kHz to 32 kHz (low), 1 MHz to 8 MHz (medium), 8 Up to 16 rapid general purpose I/O (RGPIO) pins MHz to 32 MHz (high) Low-power hardware touch sensor interface (TSI) Multipurpose clock generator (MCG) Interrupt request pin (IRQ) Memories and memory interfaces Flash memory, FlexNVM, FlexRAM, and RAM Serial programming interface (EzPort) Mini-FlexBus external bus interface 20102015 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts.......................................................................................3 5.4 Thermal specifications.................................................................20 1.1 Determining valid orderable parts............................................... 3 5.4.1 Thermal operating requirements.................................... 20 2 Part identification................................................................................. 3 5.4.2 Thermal attributes.......................................................... 20 2.1 Description...................................................................................3 6 Peripheral operating requirements and behaviors................................ 21 2.2 Format..........................................................................................3 6.1 Core modules............................................................................... 21 2.3 Fields............................................................................................3 6.1.1 Debug specifications...................................................... 21 2.4 Example....................................................................................... 4 6.2 System modules........................................................................... 21 3 Terminology and guidelines.................................................................4 6.2.1 VREG electrical specifications...................................... 21 3.1 Definition: Operating requirement...............................................4 6.3 Clock modules............................................................................. 22 3.2 Definition: Operating behavior....................................................4 6.3.1 MCG specifications........................................................22 3.3 Definition: Attribute.................................................................... 5 6.3.2 Oscillator electrical specifications................................. 24 3.4 Definition: Rating........................................................................ 5 6.4 Memories and memory interfaces................................................26 3.5 Result of exceeding a rating.........................................................6 6.4.1 Flash electrical specifications........................................ 26 3.6 Relationship between ratings and operating requirements.......... 6 6.4.2 EzPort Switching Specifications....................................29 3.7 Guidelines for ratings and operating requirements......................6 6.4.3 Mini-Flexbus Switching Specifications......................... 30 3.8 Definition: Typical value............................................................. 7 6.5 Security and integrity modules.................................................... 33 4 Ratings..................................................................................................8 6.6 Analog..........................................................................................34 4.1 Thermal handling ratings............................................................. 8 6.6.1 ADC electrical specifications.........................................34 4.2 Moisture handling ratings............................................................ 8 6.6.2 CMP and 6-bit DAC electrical specifications................37 4.3 ESD handling ratings................................................................... 8 6.6.3 12-bit DAC electrical characteristics............................. 39 4.4 Voltage and current operating ratings..........................................8 6.6.4 Voltage reference electrical specifications.....................42 5 General................................................................................................. 9 6.7 Timers.......................................................................................... 43 5.1 Typical Value Conditions............................................................ 9 6.8 Communication interfaces........................................................... 44 5.2 Nonswitching electrical specifications........................................ 9 6.8.1 SPI switching specifications.......................................... 44 5.2.1 Voltage and Current Operating Requirements...............9 6.9 Human-machine interfaces (HMI)...............................................47 5.2.2 LVD and POR operating requirements..........................10 6.9.1 TSI electrical specifications........................................... 47 5.2.3 Voltage and current operating behaviors....................... 11 7 Dimensions...........................................................................................48 5.2.4 Power mode transition operating behaviors...................12 7.1 Obtaining package dimensions.................................................... 48 5.2.5 Power consumption operating behaviors....................... 12 8 Pinout................................................................................................... 49 5.2.6 EMC radiated emissions operating behaviors................16 8.1 Signal Multiplexing and Pin Assignments...................................49 5.2.7 Designing with radiated emissions in mind................... 17 8.2 Pinout diagrams........................................................................... 51 5.2.8 Capacitance attributes.................................................... 17 8.3 Module-by-module signals.......................................................... 55 5.3 Switching electrical specifications...............................................17 9 Revision History...................................................................................64 5.3.1 General Switching Specifications.................................. 18 MCF51QU128, Rev. 5, 03/2015 2 Freescale Semiconductor, Inc.