X-On Electronics has gained recognition as a prominent supplier of MCF5471ZP200 Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. MCF5471ZP200 Microprocessors - MPU are a product manufactured by NXP. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

MCF5471ZP200 NXP

MCF5471ZP200 electronic component of NXP
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Part No.MCF5471ZP200
Manufacturer: NXP
Category: Microprocessors - MPU
Description: MPU ColdFire V4e MCF5xxx Processor RISC 32bit 200MHz 2.5V/3.3V 388-Pin BGA Tray
Datasheet: MCF5471ZP200 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 73.3204 ea
Line Total: USD 73.32 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
   
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We are delighted to provide the MCF5471ZP200 from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MCF5471ZP200 and other electronic components in the Microprocessors - MPU category and beyond.

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Freescale Semiconductor Document Number: MCF5475EC Rev. 4, 12/2007 Data Sheet MCF547x MCF547x ColdFire TEPBGA388 Microprocessor 27 mm x 27 mm Supports MCF5470, MCF5471, MCF5472, MCF5473, MCF5474, and MCF5475 Features list: endpoints, interrupt, bulk, or isochronous ColdFire V4e Core 4-Kbytes of shared endpoint FIFO RAM and 1 Kbyte Limited superscalar V4 ColdFire processor core of endpoint descriptor RAM Up to 266 MHz peak internal core frequency (410 MIPS Integrated physical layer interface [Dhrystone 2.1] @ 266 MHz) Up to four programmable serial controllers (PSCs) each Harvard architecture with separate 512-byte receive and transmit FIFOs for 32-Kbyte instruction cache UART, USART, modem, codec, and IrDA 1.1 interfaces 2 32-Kbyte data cache I C peripheral interface Memory Management Unit (MMU) DMA Serial Peripheral Interface (DSPI) Separate, 32-entry, fully-associative instruction and Optional Cryptography accelerator module data translation lookahead buffers Execution units for: Floating point unit (FPU) DES/3DES block cipher Double-precision conforms to IEE-754 standard AES block cipher Eight floating point registers RC4 stream cipher Internal master bus (XLB) arbiter MD5/SHA-1/SHA-256/HMAC hashing High performance split address and data transactions Random Number Generator Support for various parking modes 32-Kbyte system SRAM 32-bit double data rate (DDR) synchronous DRAM Arbitration mechanism shares bandwidth between (SDRAM) controller internal bus masters 66133 MHz operation System integration unit (SIU) Supports DDR and SDR DRAM Interrupt controller Built-in initialization and refresh Watchdog timer Up to four chip selects enabling up to one GB of external Two 32-bit slice timers alarm and interrupt generation memory Up to four 32-bit general-purpose timers, compare, and Version 2.2 peripheral component interconnect (PCI) bus PWM capability 32-bit target and initiator operation GPIO ports multiplexed with peripheral pins Support for up to five external PCI masters Debug and test features 3366 MHz operation with PCI bus to XLB divider ColdFire background debug mode (BDM) port ratios of 1:1, 1:2, and 1:4 JTAG/ IEEE 1149.1 test access port Flexible multi-function external bus (FlexBus) PLL and clock generator Provides a glueless interface to boot flash/ROM, 30 to 66.67 MHz input frequency range SRAM, and peripheral devices Operating Voltages Up to six chip selects 1.5V internal logic 33 66 MHz operation 2.5V DDR SDRAM bus I/O Communications I/O subsystem 3.3V PCI, FlexBus, and all other I/O Intelligent 16 channel DMA controller Estimated power consumption Up to two 10/100 Mbps fast Ethernet controllers (FECs) Less than 1.5W (388 PBGA) each with separate 2-Kbyte receive and transmit FIFOs Universal serial bus (USB) version 2.0 device controller Support for one control and six programmable Freescale Semiconductor, Inc., 2007. All rights reserved.Table of Contents 1 Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Figure 15.DDR Clock Timing Diagram. . . . . . . . . . . . . . . . . . . . 18 2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Figure 16.DDR Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.1 Operating Temperatures . . . . . . . . . . . . . . . . . . . . . . . . .4 Figure 17.DDR Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.2 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Figure 18.PCI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Figure 19.MII Receive Signal Timing Diagram. . . . . . . . . . . . . . 23 4 Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .6 Figure 20.MII Transmit Signal Timing Diagram . . . . . . . . . . . . . 23 4.1 PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Figure 21.MII Async Inputs Timing Diagram . . . . . . . . . . . . . . . 24 4.2 Supply Voltage Sequencing and Separation Cautions . .6 Figure 22.MII Serial Management Channel TIming Diagram. . . 24 2 4.3 General USB Layout Guidelines . . . . . . . . . . . . . . . . . . .8 Figure 23.I C Input/Output Timings . . . . . . . . . . . . . . . . . . . . . . 26 4.4 USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Figure 24.Test Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . 27 5 Output Driver Capability and Loading. . . . . . . . . . . . . . . . . . .10 Figure 25.Boundary Scan (JTAG) Timing . . . . . . . . . . . . . . . . . 27 6 PLL Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Figure 26.Test Access Port Timing . . . . . . . . . . . . . . . . . . . . . . 27 7 Reset Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . . . .12 Figure 27.TRST Timing Debug AC Timing Specifications . . . . . 27 8 FlexBus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Figure 28.Real-Time Trace AC Timing. . . . . . . . . . . . . . . . . . . . 28 8.1 FlexBus AC Timing Characteristics. . . . . . . . . . . . . . . .13 Figure 29.BDM Serial Port AC Timing . . . . . . . . . . . . . . . . . . . . 28 9 SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Figure 30.DSPI Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 9.1 SDR SDRAM AC Timing Characteristics . . . . . . . . . . .15 Figure 31.388-pin BGA Case Outline. . . . . . . . . . . . . . . . . . . . . 31 9.2 DDR SDRAM AC Timing Characteristics . . . . . . . . . . .18 List of Tables 10 PCI Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 1. Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . 4 11 Fast Ethernet AC Timing Specifications . . . . . . . . . . . . . . . . .22 Table 2. Operating Temperatures . . . . . . . . . . . . . . . . . . . . . . . . 4 11.1 MII/7-WIRE Interface Timing Specs . . . . . . . . . . . . . . .22 Table 3. Thermal Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 11.2 MII Transmit Signal Timing . . . . . . . . . . . . . . . . . . . . . .23 Table 4. DC Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . 5 11.3 MII Async Inputs Signal Timing (CRS, COL) . . . . . . . .24 Table 5. USB Filter Circuit Values . . . . . . . . . . . . . . . . . . . . . . . . 9 11.4 MII Serial Management Channel Timing (MDIO,MDC).24 Table 6. I/O Driver Capability . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 General Timing Specifications . . . . . . . . . . . . . . . . . . . . . . . .25 2 Table 7. Clock Timing Specifications. . . . . . . . . . . . . . . . . . . . . 11 13 I C Input/Output Timing Specifications. . . . . . . . . . . . . . . . . .25 Table 8. MCF547x Divide Ratio Encodings. . . . . . . . . . . . . . . . 11 14 JTAG and Boundary Scan Timing. . . . . . . . . . . . . . . . . . . . . .26 Table 9. Reset Timing Specifications . . . . . . . . . . . . . . . . . . . . 12 15 DSPI Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . .29 Table 10.FlexBus AC Timing Specifications. . . . . . . . . . . . . . . . 13 16 Timer Module AC Timing Specifications. . . . . . . . . . . . . . . . .29 Table 11.SDR Timing Specifications . . . . . . . . . . . . . . . . . . . . . 16 17 Case Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Table 12.DDR Clock Crossover Specifications . . . . . . . . . . . . . 18 18 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32 Table 13.DDR Timing Specifications . . . . . . . . . . . . . . . . . . . . . 18 List of Figures Table 14.PCI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 21 Figure 1.MCF547X Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 3 Table 15.MII Receive Signal Timing. . . . . . . . . . . . . . . . . . . . . . 23 Figure 2.System PLL V Power Filter . . . . . . . . . . . . . . . . . . . . 6 Table 16.MII Transmit Signal Timing . . . . . . . . . . . . . . . . . . . . . 23 DD Figure 3.Supply Voltage Sequencing and Separation Cautions . 7 Table 17.MII Transmit Signal Timing . . . . . . . . . . . . . . . . . . . . . 24 Figure 4.Preferred VBUS Connections . . . . . . . . . . . . . . . . . . . . 8 Table 18.MII Serial Management Channel Signal Timing . . . . . 24 Figure 5.Alternate VBUS Connections . . . . . . . . . . . . . . . . . . . . 8 Table 19.General AC Timing Specifications. . . . . . . . . . . . . . . . 25 2 Figure 6.USB V Power Filter . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 20.I C Input Timing Specifications between DD Figure 7.USBRBIAS Connection. . . . . . . . . . . . . . . . . . . . . . . . 10 SCL and SDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2 Figure 8.Input Clock Timing Diagram . . . . . . . . . . . . . . . . . . . . 11 Table 21. I C Output Timing Specifications between Figure 9.CLKIN, Internal Bus, and Core Clock Ratios . . . . . . . 11 SCL and SDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 10.Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 22.JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 26 Figure 11.FlexBus Read Timing . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 23.Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 28 Figure 12.FlexBus Write Timing . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 24.DSPI Modules AC Timing Specifications. . . . . . . . . . . 29 Figure 13.SDR Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 25.Timer Module AC Timing Specifications . . . . . . . . . . . 29 Figure 14.SDR Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 MCF547x ColdFire Microprocessor, Rev. 4 2 Freescale Semiconductor

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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