Freescale Semiconductor Document Number: IMX25AEC Rev. 10, 06/2013 Data Sheet: Technical Data MCIMX25 i.MX25 Applications Processor for Automotive Products Silicon Version 1.2 Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information 1 Introduction See Table 1 on page 3 for ordering information. The i.MX25 family of processors are designed to meet the connectivity requirements of todays 1. Introduction 1 1.1. Ordering Information 3 automobile infotainment systems. To meet these 1.2. Block Diagram 5 requirements, the i.MX25 processors provide 2. Features 6 high-end features, such as CAN, USB connectivity, 2.1. Special Signal Considerations 9 3. Electrical Characteristics 11 and audio connectivity at a price point that is 3.1. i.MX25 Chip-Level Conditions 11 suitable for all vehicles. 3.2. Supply Power-Up/Power-Down Requirements and Restrictions 16 At the core of the i.MX25 is Freescale s fast, 3.3. Power Characteristics 18 3.4. Thermal Characteristics 20 proven, power-efficient implementation of the 3.5. I/O DC Parameters 20 ARM 926EJ-S core, with speeds of up to 3.6. AC Electrical Characteristics 24 3.7. Module Timing and Electrical Parameters 41 400 MHz. The i.MX25 includes support for up to 4. Package Information and Contact Assignment 124 133 MHz DDR2 memory, integrated 10/100 4.1. 400 MAPBGACase 17x17 mm, 0.8 mm Pitch . 124 Ethernet MAC, and two on-chip USB PHYs. The 4.2. Ground, Power, Sense, and Reference Contact Assignments Case 17x17 mm, 0.8 mm Pitch . 125 automotive versions of the i.MX25 offer 4.3. Signal Contact Assignments17 x 17 mm, 0.8 mm AEC-Q100 grade 3 qualification to meet stringent Pitch 127 4.4. i.MX25 17x17 Package Ball Map 135 automotive quality requirements. The device is 5. Revision History 138 suitable for a wide range of applications, including the following: USB Connectivity for media storage/playback, personal media device interface, and firmware updates 2009-2013 Freescale Semiconductor, Inc. All rights reserved. Bluetooth connectivity for hands free phone calling and streaming audio from wireless devices like phones or PND Control of the infotainment system through basic speech recognition or touch screen Smart toll and metering applications Secure data black box applications Features of the i.MX25 processor include the following: Advanced power managementThe heart of the device is a level of power management throughout the IC that enables the multimedia features and peripherals to achieve minimum system power consumption in active and various low-power modes. Power management techniques allow the designer to deliver a feature-rich product that requires levels of power far lower than typical industry expectations. Multimedia powerhouseThe multimedia performance of the i.MX25 processor is boosted by a 16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen controller), and a programmable Smart DMA (SDMA) controller. 128 Kbytes on-chip SRAMThe additional 128 Kbyte on-chip SRAM makes the device ideal for eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows the designer to enable an ultra low power LCD refresh. Interface flexibilityThe device interface supports connection to all common types of external memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash, and managed NAND. Increased securityBecause the need for advanced security for tethered and untethered devices continues to increase, the i.MX25 processor delivers hardware-enabled security features that enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust tamper detection, secure boot, and secure software downloads. On-chip PHYThe device includes an HS USB OTG PHY and FS USB HOST PHY. Fast EthernetFor rapid external communication, a Fast Ethernet Controller (FEC) is included. i.MX25 only supports Little Endian mode. i.MX25 Applications Processor for Automotive Products, Rev. 10 2 Freescale Semiconductor