X-On Electronics has gained recognition as a prominent supplier of MCZ33903D3EK Power Management Specialised - PMIC across the USA, India, Europe, Australia, and various other global locations. MCZ33903D3EK Power Management Specialised - PMIC are a product manufactured by NXP. We provide cost-effective solutions for Power Management Specialised - PMIC, ensuring timely deliveries around the world.

MCZ33903D3EK NXP

MCZ33903D3EK electronic component of NXP
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Part No.MCZ33903D3EK
Manufacturer: NXP
Category: Power Management Specialised - PMIC
Description: Power Management Specialized - PMIC System Basis Chip, 2x 3.3 V/400mA LDOs, 1 wakeup, SOIC 32
Datasheet: MCZ33903D3EK Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 12.8228 ea
Line Total: USD 12.82 
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MOQ: 1  Multiples: 1
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Ship by Thu. 14 Nov to Mon. 18 Nov
MOQ : 1
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1 : USD 12.8228
10 : USD 11.4009
25 : USD 10.6643
84 : USD 9.5767
252 : USD 9.3461
504 : USD 8.5007
1008 : USD 8.0857
2520 : USD 7.9628
5040 : USD 7.9473

   
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We are delighted to provide the MCZ33903D3EK from our Power Management Specialised - PMIC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MCZ33903D3EK and other electronic components in the Power Management Specialised - PMIC category and beyond.

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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
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Power Management Specialized - PMIC System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 2/3 wakeup, SOIC 32
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
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Power Management Specialized - PMIC System Basis Chip, 2x 3.3 V/400mA LDOs, 3 wakeup, SOIC 32
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
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NXP Semiconductors Document Number: MC33903 4 5 Rev. 14.0, 2/2018 Data Sheet: Advance Information SBC Gen2 with CAN high speed and 33903/ 33903/4/5 LIN interface The 33903/4/5 is the second generation family of the System Basis Chip (SBC). It combines several features and enhances present module designs. The device works as an advanced power management unit for the MCU with additional SYSTEM BASIS CHIP integrated circuits such as sensors and CAN transceivers. It has a built-in enhanced high-speed CAN interface (ISO11898-2 and -5) with local and bus failure diagnostics, protection, and fail-safe operation modes. The SBC may include zero, one or two LIN 2.1 interfaces with LIN output pin switches. It includes up to four wake-up input pins that can also be configured as output drivers for flexibility. This device is powered by SMARTMOS technology. This device implements multiple Low-power (LP) modes, with very low-current consumption. In addition, the device is part of a family concept where pin compatibility adds versatility to module design. EK Suffix (Pb-free) EK Suffix (Pb-free) 98ASA10556D 98ASA10506D The 33903/4/5 also implements an innovative and advanced fail-safe state 32-PIN SOIC 54-PIN SOIC machine and concept solution. Applications Features Voltage regulator for MCU, 5.0 or 3.3 V, part number selectable, with Aircraft and marine systems possibility of usage external PNP to extend current capability and share power Automotive and robotic systems dissipation Farm equipment Voltage, current, and temperature protection Industrial actuator controls Extremely low quiescent current in LP modes Lamp and inductive load controls Fully-protected embedded 5.0 V regulator for the CAN driver DC motor control applications requiring diagnostics Multiple undervoltage detections to address various MCU specifications and Applications where high-side switch control is system operation modes (i.e. cranking) required Auxiliary 5.0 or 3.3 V SPI configurable regulator, for additional ICs, with overcurrent detection and undervoltage protection MUX output pin for device internal analog signal monitoring and power supply monitoring Advanced SPI, MCU, ECU power supply, and critical pins diagnostics and monitoring. Multiple wake-up sources in LP modes: CAN or LIN bus, I/O transition, automatic timer, SPI message, and V overcurrent detection. DD ISO11898-5 high-speed CAN interface compatibility for baud rates of 40 kb/s to 1.0 Mb/s Scalable product family of devices ranging from 0 to 2 LINs which are compatible to J2602-2 and LIN 2.1 * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. NXP B.V. 2018.Table of Contents 1. Simplified application diagrams ..................................................................................................................................................... 3 2. Orderable part ................................................................................................................................................................................ 7 3. Internal block diagrams .................................................................................................................................................................. 9 4. Pin Connections ........................................................................................................................................................................... 11 4.1. Pinout diagram ....................................................................................................................................................................... 11 5. Electrical characteristics .............................................................................................................................................................. 16 5.1. Maximum ratings .................................................................................................................................................................... 16 5.2. Static electrical characteristics ............................................................................................................................................... 18 5.3. Dynamic electrical characteristics .......................................................................................................................................... 26 5.4. Timing diagrams .................................................................................................................................................................... 29 6. Functional description .................................................................................................................................................................. 32 6.1. Introduction ............................................................................................................................................................................ 32 6.2. Functional pin description ...................................................................................................................................................... 32 7. Functional device operation ......................................................................................................................................................... 36 7.1. Mode and state description .................................................................................................................................................... 36 7.2. LP modes ............................................................................................................................................................................... 37 7.3. State diagram ......................................................................................................................................................................... 39 7.4. Mode change ......................................................................................................................................................................... 40 7.5. Watchdog operation ............................................................................................................................................................... 40 7.6. Functional block operation versus mode ............................................................................................................................... 43 7.7. Illustration of device mode transitions .................................................................................................................................... 44 7.8. Cyclic sense operation during LP modes ............................................................................................................................... 45 7.9. Cyclic INT operation during LP VDD on mode ....................................................................................................................... 47 7.10. Behavior at power up and power down ................................................................................................................................ 48 7.11. Fail-safe operation ............................................................................................................................................................... 51 8. CAN interface .............................................................................................................................................................................. 55 8.1. CAN interface description ...................................................................................................................................................... 55 8.2. CAN bus fault diagnostic ........................................................................................................................................................ 58 9. LIN block ...................................................................................................................................................................................... 62 9.1. LIN interface description ........................................................................................................................................................ 62 9.2. LIN operational modes ........................................................................................................................................................... 63 10. Serial peripheral interface .......................................................................................................................................................... 64 10.1. High level overview .............................................................................................................................................................. 64 10.2. Detail operation .................................................................................................................................................................... 64 10.3. Detail of control bits and register mapping ........................................................................................................................... 68 10.4. Flags and device status ....................................................................................................................................................... 84 11. Typical applications ................................................................................................................................................................... 92 12. Packaging ................................................................................................................................................................................ 100 12.1. SOIC 32 package dimensions ........................................................................................................................................... 100 12.2. SOIC 54 package dimensions ........................................................................................................................................... 103 13. Revision history ....................................................................................................................................................................... 106 33903/4/5 2 NXP Semiconductors

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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NXP SEMI
NXP Semicon
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NXP Semiconductors
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PHI
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