X-On Electronics has gained recognition as a prominent supplier of MIMX8MM1DVTLZAA Microprocessors - MPU across the USA, India, Europe, Australia, and various other global locations. MIMX8MM1DVTLZAA Microprocessors - MPU are a product manufactured by NXP. We provide cost-effective solutions for Microprocessors - MPU, ensuring timely deliveries around the world.

MIMX8MM1DVTLZAA NXP

MIMX8MM1DVTLZAA electronic component of NXP
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Part No.MIMX8MM1DVTLZAA
Manufacturer: NXP
Category: Microprocessors - MPU
Description: Processors - Application Specialized MIMX8MM1DVTLZAALFBGA486TRAY MULTIPLE DP BAKEAB
Datasheet: MIMX8MM1DVTLZAA Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 29.6585 ea
Line Total: USD 29.66 
Availability - 227
Ship by Mon. 18 Nov to Wed. 20 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
227
Ship by Mon. 18 Nov to Wed. 20 Nov
MOQ : 1
Multiples : 1
1 : USD 29.6585
10 : USD 25.1275
100 : USD 24.3685
250 : USD 24.1615
456 : USD 24.15
1064 : USD 24.127
2584 : USD 24.1155
5016 : USD 24.104
10032 : USD 24.0925

   
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We are delighted to provide the MIMX8MM1DVTLZAA from our Microprocessors - MPU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MIMX8MM1DVTLZAA and other electronic components in the Microprocessors - MPU category and beyond.

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Document Number: IMX8MMCEC NXP Semiconductors Rev. 1, 07/2020 Data Sheet: Technical Data MIMX8MM6DVTLZAA MIMX8MM5DVTLZAA MIMX8MM5DVTLZCA MIMX8MM5DVTLZDA MIMX8MM4DVTLZAA MIMX8MM3DVTLZAA MIMX8MM2DVTLZAA MIMX8MM1DVTLZAA i.MX 8M Mini Applications Processor Datasheet for Consumer Products Package Information Plastic Package FCBGA 14 x 14 mm, 0.5 mm pitch Ordering Information See Table 2 on page 6 1 i.MX 8M Mini introduction The i.MX 8M Mini applications processor represents 1. i.MX 8M Mini introduction 1 1.1. Block diagram 5 NXPs latest video and audio experience combining 1.2. Ordering information . 6 state-of-the-art media-specific features with 2. Modules list . 8 2.1. Recommended connections for unused input/output 12 high-performance processing while optimized for lowest 3. Electrical characteristics 14 power consumption. 3.1. Chip-level conditions 14 3.2. Power supplies requirements and restrictions . 23 The i.MX 8M Mini family of processors features 3.3. PLL electrical characteristics 26 3.4. On-chip oscillators 27 advanced implementation of a quad Arm Cor- 3.6. I/O AC parameters . 29 tex -A53 core, which operates at speeds of up to 3.5. General purpose I/O (GPIO) DC parameters . 28 3.7. Output buffer impedance parameters . 30 1.8GHz. A general purpose Cortex -M4 400 MHz 3.8. System modules timing 32 3.9. External peripheral interface parameters 33 core processor is for low-power processing. The DRAM 4. Boot mode configuration 68 controller supports 32-bit/16-bit LPDDR4, DDR4, and 4.1. Boot mode configuration pins . 68 4.2. Boot device interface allocation 69 DDR3L memory. A wide range of audio interfaces are 5. Package information and contact assignments . 70 available, including I2S, AC97, TDM, and S/PDIF. 5.1. 14 x 14 mm package information 70 5.2. DDR pin function list 87 There are a number of other interfaces for connecting 6. Revision history . 91 peripherals, such as USB, PCIe, and Ethernet. NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.i.MX 8M Mini introduction Table 1. Features Subsystem Features Arm Cortex-A53 MPCore platform Quad symmetric Cortex-A53 processors 32 KB L1 Instruction Cache 32 KB L1 Data Cache Media Processing Engine (MPE) with NEON technology supporting the Advanced Single Instruction Multiple Data architecture: Floating Point Unit (FPU) with support of the VFPv4-D16 architecture Support of 64-bit Armv8-A architecture 512 KB unified L2 cache Arm Cortex-M4 core platform Low power microcontroller available for customer application: low power standby mode IoT features including Weave Manage IR or Wireless Remote Cortex M4 CPU: 16 KB L1 Instruction Cache 16 KB L1 Data Cache 256 KB tightly coupled memory (TCM) Connectivity One PCI Express (PCIe) Single lane supporting PCIe Gen2 Dual mode operation to function as root complex or endpoint Integrated PHY interface Support L1 low power sub-state Two USB 2.0 OTG controllers with integrated PHY interfaces: Spread spectrum clock support Three Ultra Secure Digital Host Controller (uSDHC) interfaces: MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100 MB/sec Support for SDXC (extended capacity) One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE), Ethernet AVB, and IEEE 1588 Four Universal Asynchronous Receiver/Transmitter (UART) modules 2 Four I C modules Three ECSPI modules On-chip memory Boot ROM (256 KB) On-chip RAM (256 KB + 32 KB) GPIO and pin multiplexing General-purpose input/output (GPIO) modules with interrupt capability Input/output multiplexing controller (IOMUXC) to provide centralized pad control Power management Temperature sensor with programmable trip points Flexible power domain partitioning with internal power switches to support efficient power management i.MX 8M Mini Applications Processor Datasheet for Consumer Products, Rev. 1, 07/2020 2 NXP Semiconductors

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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