Document Number: K40P64M72SF1 Freescale Semiconductor Rev. 3, 11/2012 Data Sheet: Technical Data K40P64M72SF1 K40 Sub-Family Supports: MK40DX64VLH7, MK40DX128VLH7, MK40DX256VLH7 Features Analog modules Operating Characteristics Two 16-bit SAR ADCs Voltage range: 1.71 to 3.6 V Programmable gain amplifier (PGA) (up to x64) Flash write voltage range: 1.71 to 3.6 V integrated into each ADC Temperature range (ambient): -40 to 105C 12-bit DAC Three analog comparators (CMP) containing a 6-bit Clocks DAC and programmable reference input 3 to 32 MHz crystal oscillator Voltage reference 32 kHz crystal oscillator Multi-purpose clock generator Timers Programmable delay block System peripherals Eight-channel motor control/general purpose/PWM Multiple low-power modes to provide power timer optimization based on application requirements Two 2-channel quadrature decoder/general purpose 16-channel DMA controller, supporting up to 63 timers request sources Periodic interrupt timers External watchdog monitor 16-bit low-power timer Software watchdog Carrier modulator transmitter Low-leakage wakeup unit Real-time clock Security and integrity modules Communication interfaces Hardware CRC module to support fast cyclic USB full-/low-speed On-the-Go controller with on- redundancy checks chip transceiver 128-bit unique identification (ID) number per chip Controller Area Network (CAN) module SPI module Human-machine interface Two I2C modules Segment LCD controller supporting up to 36 Three UART modules frontplanes and 8 backplanes, or 40 frontplanes and I2S module 4 backplanes, depending on the package size Low-power hardware touch sensor interface (TSI) General-purpose input/output Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 6 Peripheral operating requirements and behaviors....................21 1.1 Determining valid orderable parts......................................3 6.1 Core modules....................................................................22 2 Part identification......................................................................3 6.1.1 Debug trace timing specifications.........................22 2.1 Description.........................................................................3 6.1.2 JTAG electricals....................................................22 2.2 Format...............................................................................3 6.2 System modules................................................................25 2.3 Fields.................................................................................3 6.3 Clock modules...................................................................25 2.4 Example............................................................................4 6.3.1 MCG specifications...............................................25 3 Terminology and guidelines......................................................4 6.3.2 Oscillator electrical specifications.........................27 3.1 Definition: Operating requirement......................................4 6.3.3 32 kHz Oscillator Electrical Characteristics...........30 3.2 Definition: Operating behavior...........................................5 6.4 Memories and memory interfaces.....................................30 3.3 Definition: Attribute............................................................5 6.4.1 Flash electrical specifications................................30 3.4 Definition: Rating...............................................................6 6.4.2 EzPort Switching Specifications............................35 3.5 Result of exceeding a rating..............................................6 6.5 Security and integrity modules..........................................36 3.6 Relationship between ratings and operating 6.6 Analog...............................................................................36 requirements......................................................................6 6.6.1 ADC electrical specifications.................................36 3.7 Guidelines for ratings and operating requirements............7 6.6.2 CMP and 6-bit DAC electrical specifications.........43 3.8 Definition: Typical value.....................................................7 6.6.3 12-bit DAC electrical characteristics.....................46 3.9 Typical value conditions....................................................8 6.6.4 Voltage reference electrical specifications............49 4 Ratings......................................................................................9 6.7 Timers................................................................................50 4.1 Thermal handling ratings...................................................9 6.8 Communication interfaces.................................................50 4.2 Moisture handling ratings..................................................9 6.8.1 USB electrical specifications.................................50 4.3 ESD handling ratings.........................................................9 6.8.2 USB DCD electrical specifications........................51 4.4 Voltage and current operating ratings...............................9 6.8.3 USB VREG electrical specifications......................51 5 General.....................................................................................10 6.8.4 CAN switching specifications................................52 5.1 AC electrical characteristics..............................................10 6.8.5 DSPI switching specifications (limited voltage 5.2 Nonswitching electrical specifications...............................10 range)....................................................................52 5.2.1 Voltage and current operating requirements.........11 6.8.6 DSPI switching specifications (full voltage range).53 5.2.2 LVD and POR operating requirements.................11 6.8.7 I2C switching specifications..................................55 5.2.3 Voltage and current operating behaviors..............12 6.8.8 UART switching specifications..............................55 5.2.4 Power mode transition operating behaviors..........13 6.8.9 I2S/SAI Switching Specifications..........................55 5.2.5 Power consumption operating behaviors..............14 6.9 Human-machine interfaces (HMI)......................................60 5.2.6 Designing with radiated emissions in mind...........18 6.9.1 TSI electrical specifications...................................60 5.2.7 Capacitance attributes..........................................18 6.9.2 LCD electrical characteristics................................61 5.3 Switching specifications.....................................................19 7 Dimensions...............................................................................62 5.3.1 Device clock specifications...................................19 7.1 Obtaining package dimensions.........................................62 5.3.2 General switching specifications...........................19 8 Pinout........................................................................................62 5.4 Thermal specifications.......................................................20 8.1 K40 Signal Multiplexing and Pin Assignments..................62 5.4.1 Thermal operating requirements...........................20 8.2 K40 Pinouts.......................................................................65 5.4.2 Thermal attributes.................................................21 9 Revision History........................................................................66 K40 Sub-Family Data Sheet, Rev. 3, 11/2012. 2 Freescale Semiconductor, Inc.