MK50DX128CLK7 NXP

Document Number: K50P81M72SF1 Freescale Semiconductor Rev. 3, 11/2012 Data Sheet: Technical Data K50P81M72SF1 K50 Sub-Family Supports: MK50DX128CLK7, MK50DX256CLK7 Features Timers Operating Characteristics Programmable delay block Voltage range: 1.71 to 3.6 V Eight-channel motor control/general purpose/PWM Flash write voltage range: 1.71 to 3.6 V timer Temperature range (ambient): -40 to 85C Two 2-channel quadrature decoder/general purpose timers Clocks Periodic interrupt timers 3 to 32 MHz crystal oscillator 16-bit low-power timer 32 kHz crystal oscillator Carrier modulator transmitter Multi-purpose clock generator Real-time clock System peripherals Communication interfaces Multiple low-power modes to provide power USB full-/low-speed On-the-Go controller with on- optimization based on application requirements chip transceiver 16-channel DMA controller, supporting up to 63 Two SPI modules request sources Two I2C modules External watchdog monitor Four UART modules Software watchdog I2S module Low-leakage wakeup unit Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Human-machine interface Low-power hardware touch sensor interface (TSI) General-purpose input/output Analog modules Two 16-bit SAR ADCs Programmable gain amplifier (PGA) (up to x64) integrated into each ADC 12-bit DAC Two operational amplifiers One transimpedance amplifier Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input Voltage reference Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6.1 Core modules....................................................................23 1.1 Determining valid orderable parts......................................4 6.1.1 Debug trace timing specifications.........................23 2 Part identification......................................................................4 6.1.2 JTAG electricals....................................................23 2.1 Description.........................................................................4 6.2 System modules................................................................26 2.2 Format...............................................................................4 6.3 Clock modules...................................................................26 2.3 Fields.................................................................................4 6.3.1 MCG specifications...............................................26 2.4 Example............................................................................5 6.3.2 Oscillator electrical specifications.........................28 3 Terminology and guidelines......................................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........31 3.1 Definition: Operating requirement......................................5 6.4 Memories and memory interfaces.....................................31 3.2 Definition: Operating behavior...........................................6 6.4.1 Flash electrical specifications................................31 3.3 Definition: Attribute............................................................6 6.4.2 EzPort Switching Specifications............................36 3.4 Definition: Rating...............................................................7 6.4.3 Flexbus Switching Specifications..........................37 3.5 Result of exceeding a rating..............................................7 6.5 Security and integrity modules..........................................40 3.6 Relationship between ratings and operating 6.6 Analog...............................................................................40 requirements......................................................................7 6.6.1 ADC electrical specifications.................................40 3.7 Guidelines for ratings and operating requirements............8 6.6.2 CMP and 6-bit DAC electrical specifications.........48 3.8 Definition: Typical value.....................................................8 6.6.3 12-bit DAC electrical characteristics.....................50 3.9 Typical value conditions....................................................9 6.6.4 Op-amp electrical specifications...........................53 4 Ratings......................................................................................10 6.6.5 Transimpedance amplifier electrical 4.1 Thermal handling ratings...................................................10 specifications full range....................................54 4.2 Moisture handling ratings..................................................10 6.6.6 Transimpedance amplifier electrical 4.3 ESD handling ratings.........................................................10 specifications limited range..............................55 4.4 Voltage and current operating ratings...............................10 6.6.7 Voltage reference electrical specifications............56 5 General.....................................................................................11 6.7 Timers................................................................................57 5.1 AC electrical characteristics..............................................11 6.8 Communication interfaces.................................................57 5.2 Nonswitching electrical specifications...............................11 6.8.1 USB electrical specifications.................................57 5.2.1 Voltage and current operating requirements.........12 6.8.2 USB DCD electrical specifications........................58 5.2.2 LVD and POR operating requirements.................12 6.8.3 USB VREG electrical specifications......................58 5.2.3 Voltage and current operating behaviors..............13 6.8.4 DSPI switching specifications (limited voltage 5.2.4 Power mode transition operating behaviors..........14 range)....................................................................58 5.2.5 Power consumption operating behaviors..............15 6.8.5 DSPI switching specifications (full voltage range).60 5.2.6 Designing with radiated emissions in mind...........19 6.8.6 I2C switching specifications..................................62 5.2.7 Capacitance attributes..........................................19 6.8.7 UART switching specifications..............................62 5.3 Switching specifications.....................................................20 6.8.8 I2S/SAI Switching Specifications..........................62 5.3.1 Device clock specifications...................................20 6.9 Human-machine interfaces (HMI)......................................66 5.3.2 General switching specifications...........................20 6.9.1 TSI electrical specifications...................................66 5.4 Thermal specifications.......................................................21 7 Dimensions...............................................................................67 5.4.1 Thermal operating requirements...........................21 7.1 Obtaining package dimensions.........................................67 5.4.2 Thermal attributes.................................................22 8 Pinout........................................................................................68 6 Peripheral operating requirements and behaviors....................22 8.1 K50 Signal Multiplexing and Pin Assignments..................68 K50 Sub-Family Data Sheet, Rev. 3, 11/2012. 2 Freescale Semiconductor, Inc.