Document Number: K51P144M100SF2V2 Freescale Semiconductor Rev. 3, 6/2013 Data Sheet: Technical Data K51P144M100SF2V2 K51 Sub-Family Supports the following: MK51DN256CLQ10, MK51DN256CMD10, MK51DN512CLQ10, MK51DN512CMD10 Features Human-machine interface Operating Characteristics Segment LCD controller supporting up to 40 Voltage range: 1.71 to 3.6 V frontplanes and 8 backplanes, or 44 frontplanes and Flash write voltage range: 1.71 to 3.6 V 4 backplanes, depending on the package size Temperature range (ambient): -40 to 85C Low-power hardware touch sensor interface (TSI) General-purpose input/output Performance Up to 100 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per Two 16-bit SAR ADCs MHz Programmable gain amplifier (PGA) (up to x64) integrated into each ADC Memories and memory interfaces Two 12-bit DACs Up to 512 KB program flash memory on non- Two operational amplifiers FlexMemory devices Two transimpedance amplifiers Up to 128 KB RAM Three analog comparators (CMP) containing a 6-bit Serial programming interface (EzPort) DAC and programmable reference input FlexBus external bus interface Voltage reference Clocks Timers 3 to 32 MHz crystal oscillator Programmable delay block 32 kHz crystal oscillator Eight-channel motor control/general purpose/PWM Multi-purpose clock generator timer Two 2-channel quadrature decoder/general purpose System peripherals timers Multiple low-power modes to provide power Periodic interrupt timers optimization based on application requirements 16-bit low-power timer Memory protection unit with multi-master Carrier modulator transmitter protection Real-time clock 16-channel DMA controller, supporting up to 63 request sources Communication interfaces External watchdog monitor USB full-/low-speed On-the-Go controller with on- Software watchdog chip transceiver Low-leakage wakeup unit Three SPI modules Two I2C modules Security and integrity modules Six UART modules Hardware CRC module to support fast cyclic Secure Digital host controller (SDHC) redundancy checks I2S module 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6 Peripheral operating requirements and behaviors....................23 1.1 Determining valid orderable parts......................................4 6.1 Core modules....................................................................23 2 Part identification......................................................................4 6.1.1 Debug trace timing specifications.........................23 2.1 Description.........................................................................4 6.1.2 JTAG electricals....................................................24 2.2 Format...............................................................................4 6.2 System modules................................................................27 2.3 Fields.................................................................................4 6.3 Clock modules...................................................................27 2.4 Example............................................................................5 6.3.1 MCG specifications...............................................27 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.........................29 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics.............32 3.2 Definition: Operating behavior...........................................6 6.4 Memories and memory interfaces.....................................32 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications................................32 3.4 Definition: Rating...............................................................7 6.4.2 EzPort switching specifications.............................34 3.5 Result of exceeding a rating..............................................7 6.4.3 Flexbus switching specifications...........................35 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................38 requirements......................................................................7 6.6 Analog...............................................................................38 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications.................................38 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........46 3.9 Typical value conditions....................................................9 6.6.3 12-bit DAC electrical characteristics.....................49 4 Ratings......................................................................................10 6.6.4 Op-amp electrical specifications...........................52 4.1 Thermal handling ratings...................................................10 6.6.5 Transimpedance amplifier electrical 4.2 Moisture handling ratings..................................................10 specifications full range....................................53 4.3 ESD handling ratings.........................................................10 6.6.6 Transimpedance amplifier electrical 4.4 Voltage and current operating ratings...............................10 specifications limited range..............................54 5 General.....................................................................................11 6.6.7 Voltage reference electrical specifications............55 5.1 AC electrical characteristics..............................................11 6.7 Timers................................................................................56 5.2 Nonswitching electrical specifications...............................11 6.8 Communication interfaces.................................................56 5.2.1 Voltage and current operating requirements.........12 6.8.1 USB electrical specifications.................................56 5.2.2 LVD and POR operating requirements.................13 6.8.2 USB DCD electrical specifications........................57 5.2.3 Voltage and current operating behaviors..............13 6.8.3 USB VREG electrical specifications......................57 5.2.4 Power mode transition operating behaviors..........15 6.8.4 DSPI switching specifications (limited voltage 5.2.5 Power consumption operating behaviors..............16 range)....................................................................57 5.2.6 EMC radiated emissions operating behaviors.......19 6.8.5 DSPI switching specifications (full voltage range).59 5.2.7 Designing with radiated emissions in mind...........20 6.8.6 Inter-Integrated Circuit Interface (I2C) timing........61 5.2.8 Capacitance attributes..........................................20 6.8.7 UART switching specifications..............................62 5.3 Switching specifications.....................................................20 6.8.8 SDHC specifications.............................................62 5.3.1 Device clock specifications...................................20 6.8.9 I2S/SAI switching specifications............................63 5.3.2 General switching specifications...........................21 6.9 Human-machine interfaces (HMI)......................................69 5.4 Thermal specifications.......................................................22 6.9.1 TSI electrical specifications...................................69 5.4.1 Thermal operating requirements...........................22 6.9.2 LCD electrical characteristics................................70 5.4.2 Thermal attributes.................................................22 7 Dimensions...............................................................................71 K51 Sub-Family Data Sheet, Rev. 3, 6/2013. 2 Freescale Semiconductor, Inc.