NE1617ADS,112 NXP

NE1617A Temperature monitor for microprocessor systems Rev. 5 20 March 2012 Product data sheet 1. General description The NE1617A is an accurate two-channel temperature monitor. It measures the temperature of itself and the temperature of a remote sensor. The remote sensor is a diode connected transistor. This can be in the form of either a discrete NPN/PNP, such as the 2N3904/2N3906, or a diode connected PNP built into another die, such as is done on some Intel microprocessors. The temperature of both the remote and local sensors is stored in a register that can be read via a 2-wire SMBus. The temperatures are updated at a rate that is programmable via the SMBus (the average supply current is dependent upon the update rate the faster the rate, the higher the current). In addition to the normal operation, which is to update the temperature at the programmed rate, there is a one-shot mode that will force a temperature update. There is also an alarm that senses either an overtemperature or undertemperature condition. The trip points for this alarm are also programmable. The device can have one of nine addresses (determined by two address pins), so there can be up to nine of the NE1617A on the SMBus. It can also be put in standby mode (in order to save power). This can be done either with software (over the SMBus) or with hardware (using the STBY pin). 2. Features and benefits Replacement for Maxim MAX1617 and Analog Devices ADM1021 Monitors local and remote temperature Local (on-chip) sensor accuracy: 2 C at 60 C to 100 C 3 C at 40 C to 125 C Remote sensor accuracy: 3 C at 60 C to 100 C 5 C at 40 C to 125 C No calibration required Programmable overtemperature/undertemperature alarm SMBus 2-wire serial interface up to 100 kHz 3 V to 5.5 V supply range 5.5 V tolerant 70 A supply current in operating mode 3 A (typical) supply current in standby modeNE1617A NXP Semiconductors Temperature monitor for microprocessor systems ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per JESD22-C101 Latch-up testing is done to JEDEC standard JESD78, which exceeds 100 mA Small 16-lead SSOP (QSOP) package 3. Applications Desktop computers Notebook computers Smart battery packs Industrial controllers Telecommunications equipment 4. Ordering information Table 1. Ordering information = 40 C to +125 C. T amb Type number Topside Package mark Name Description Version 1 plastic shrink small outline package 16 leads body width 3.9 mm SOT519-1 NE1617ADS NE1617A SSOP16 lead pitch 0.635 mm 1 Also known as QSOP16. NE1617A All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 20 March 2012 2 of 30