OM7808/BGU7003W/FMHI,598 NXP

BGU7003W Wideband silicon germanium low-noise amplifier MMIC Rev. 2 11 April 2013 Product data sheet 1. Product profile 1.1 General description The BGU7003W MMIC is a wideband amplifier in SiGe:C technology for high speed, low-noise applications in a plastic, leadless 6 pin, extremely thin small outline SOT886 package. Table 1. Application information 1 T = 25 C V = 2.85 V I = 3.2 mA V 0.7 V f = 100 MHz Z = Z = 50 unless amb CC CC(tot) ENABLE S L otherwise specified. All measurements are done with the SMA-connectors as reference plane. 2 Application NF s RL RL P P IP3 IP3 21 in out i(1dB) L(1dB) I O (dB) (dB) (dB) (dB) (dBm) (dBm) (dBm) (dBm) 2 2 2 high-ohmic FM LNA 1.2 13 0.5 16.5 23 11 15 1 I = I + I + I . CC(tot) CC RF OUT R BIAS 2 The third order intercept point is measured at 30 dBm per tone at RF IN (f = 100 MHz f = 100.2 MHz) 1 2 1.2 Features and benefits Low noise high gain microwave MMIC Applicable between 40 MHz and 6 GHz Integrated temperature stabilized bias for easy design Bias current configurable with external resistor 110 GHz transit frequency - SiGe:C technology Power-down mode current consumption < 1 A ESD protection > 1 kV Human Body Model (HBM) on all pins 1.3 Applications GPS FM LNA Low-noise amplifiers for microwave communications systems WLAN and CDMA applications Analog / digital cordless applicationsBGU7003W NXP Semiconductors Wideband silicon germanium low-noise amplifier MMIC 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1R BIAS 6 5 4 5 6 2RF IN 3GND 2 4 4RF OUT 13 5 ENABLE sym128 1 2 3 6V CC Transparent top view 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BGU7003W XSON6 plastic extremely thin small outline package no leads SOT886 6 terminals body 1 1.45 0.5 mm 4. Marking Table 4. Marking codes Type number Marking code BGU7003W UW 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage RF input AC coupled - 3.0 V CC I total supply current configurable with external resistor - 25 mA CC(tot) 1 P total power dissipation T 103 C -70 mW tot sp T storage temperature 65 +150 C stg T junction temperature - 150 C j 1 T is the temperature at the solder point of the ground lead. sp 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to solder point 235 K/W th(j-sp) BGU7003W All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved. Product data sheet Rev. 2 11 April 2013 2 of 14