PTN3944EWY NXP

PTN3944 Multi-channel PCIe 4.0 linear equalizer Rev. 1.1 10 June 2021 Product data sheet 1 General description PTN3944 is a high-performance multi-channel (x4) linear equalizer that is optimized for PCIe 4.0, UPI, and similar high-speed interfaces. PTN3944 addresses high-speed signal quality enhancement requirements for implementation of PCIe and UPI interfaces 1 . The device provides programmable linear equalization, output swing linearity control by 2 pin strapping or I C control to improve signal integrity and enable channel extension by reducing Inter-Symbol Interference (ISI). The equalizer supports use across a variety of channel conditions. PTN3944 is powered from a 1.8 V supply. It is available in a small high performance HWFLGA36 package. 2 Features Supports PCIe Gen1 (2.5 Gbps) x4, Gen2 (5 Gbps) x4, Gen3 (8 Gbps) x4, and Gen4 (16 Gbps) x4 Peaking gain up to 18.3 dB at 8 GHz Output swing linearity control: 500 mV to 950 mV ppd ppd Flat gain of +0.7 dB or -0.7 dB 2 Configurable via I C interface (supports 16 slave addresses) Supports maximum voltage limit (V ) to align to the latest system platform voltage jump capabilities Integrated termination resistors provide impedance matching on both transmit and receive sides RX equalizers on all high-speed channels to compensate for signal attenuation Good linearity over the frequency band (DC to Nyquist Frequency) and input voltage dynamic range Differential input/output return loss performance < -15 dB up to 8 GHz Flow-through pin-out to ease PCB layout and minimize crosstalk effects Very low crosstalk: DDNEXT < -60 dB up to 8 GHz Very low crosstalk: DDFEXT < -50 dB up to 8 GHz Low active current consumption for output swing linearity control of 950 mV ppd Single channel: 62 mA (typ) Two channels: 125 mA (typ) Four channels: 250 mA (typ) Power Supply 1.7 V to 1.9 V Small high performance HWFLGA36 package ESD HBM 1.5 kV, CDM 1 kV Operating temperature range -20 C to +85 CNXP Semiconductors PTN3944 Multi-channel PCIe 4.0 linear equalizer 3 Applications Servers Data centers AI/ML hardware accelerators Hub or dock devices Edge mobile computing devices 4 Ordering information Table 1.Ordering information Type number Topside Package marking Name Description Version PTN3944EW 44 HWFLGA36 plastic thermal enhanced very very thin SOT1948-1 fine-pitch land grid array package 4.1 Ordering options Table 2.Ordering options Type number Orderable part Package Packing method Minimum order Temperature number quantity PTN3944EW PTN3944EWY HWFLGA36 REEL 13 Q1 DP 7000 T = -20 C to 85 C amb PTN3944 All information provided in this document is subject to legal disclaimers. NXP B.V. 2021. All rights reserved. Product data sheet Rev. 1.1 10 June 2021 2 / 42