Freescale Semiconductor Document Number: MPC5604BC Rev. 11.1, 10/2013 Data Sheet: Advance Information MPC5604B/C MAPBGA225 QFN12 144 LQFP 208 MAPBGA 15 mm x 15 mm mm x mm (20 x 20 x 1.4 mm) (17 x 17 x 1.7 mm) MPC5604B/C SOT-343R PKG-TBD mm x mm mm x mm 100 LQFP 64 LQFP TBD Microcontroller Data Sheet (14 x 14 x 1.4 mm) (10 x 10 x 1.4 mm) 1 Introduction . 2 Features 1.1 Document overview 2 Single issue, 32-bit CPU core complex (e200z0) 1.2 Description . 2 Compliant with the Power Architecture embedded category 2 Block diagram . 4 Includes an instruction set enhancement allowing variable 3 Package pinouts and signal descriptions . 8 length encoding (VLE) for code size footprint reduction. With 3.1 Package pinouts . 8 the optional encoding of mixed 16-bit and 32-bit instructions, it 3.2 Pad configuration during reset phases . 11 is possible to achieve significant code size footprint reduction. 3.3 Voltage supply pins 12 Up to 512 KB on-chip code flash supported with the flash controller 3.4 Pad types . 12 and ECC 3.5 System pins . 13 64 (4 16) KB on-chip data flash memory with ECC Up to 48 KB on-chip SRAM with ECC 3.6 Functional ports 13 Memory protection unit (MPU) with 8 region descriptors and 32-byte 3.7 Nexus 2+ pins 29 region granularity 3.8 Electrical characteristics 29 Interrupt controller (INTC) with 148 interrupt vectors, including 16 3.9 Introduction 29 external interrupt sources and 18 external interrupt/wakeup sources 3.10 Parameter classification 30 Frequency modulated phase-locked loop (FMPLL) 3.11 NVUSRO register . 30 Crossbar switch architecture for concurrent access to peripherals, flash 3.12 Absolute maximum ratings 32 memory, or RAM from multiple bus masters 3.13 Recommended operating conditions 33 Boot assist module (BAM) supports internal flash programming via a 3.14 Thermal characteristics 35 serial link (CAN or SCI) 3.15 I/O pad electrical characteristics 36 Timer supports input/output channels providing a range of 16-bit input 3.16 RESET electrical characteristics . 46 capture, output compare, and pulse width modulation functions 3.17 Power management electrical characteristics . 48 (eMIOS-lite) 3.18 Power consumption . 54 10-bit analog-to-digital converter (ADC) 3.19 Flash memory electrical characteristics 56 3 serial peripheral interface (DSPI) modules 3.20 Electromagnetic compatibility (EMC) characteristics 58 Up to 4 serial communication interface (LINFlex) modules 3.21 Fast external crystal oscillator (4 to 16 MHz) electrical Up to 6 enhanced full CAN (FlexCAN) modules with configurable characteristics 60 buffers 2 3.22 Slow external crystal oscillator (32 kHz) electrical 1 inter IC communication interface (I C) module characteristics 63 Up to 123 configurable general purpose pins supporting input and output operations (package dependent) 3.23 FMPLL electrical characteristics 65 Real Time Counter (RTC) with clock source from 128 kHz or 16 MHz 3.24 Fast internal RC oscillator (16 MHz) electrical internal RC oscillator supporting autonomous wakeup with 1 ms characteristics 66 resolution with max timeout of 2 seconds 3.25 Slow internal RC oscillator (128 kHz) electrical Up to 6 periodic interrupt timers (PIT) with 32-bit counter resolution characteristics 67 1 System Module Timer (STM) 3.26 ADC electrical characteristics 69 Nexus development interface (NDI) per IEEE-ISTO 5001-2003 Class 3.27 On-chip peripherals . 76 Two Plus standard 4 Package characteristics . 86 Device/board boundary Scan testing supported with per Joint Test 4.1 Package mechanical data 86 Action Group (JTAG) of IEEE (IEEE 1149.1) 5 Ordering information . 97 On-chip voltage regulator (VREG) for regulation of input supply for 6 Document revision history . 97 all internal levels Appendix AAbbreviations 106 This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. Freescale Semiconductor, Inc., 2009-2013. All rights reserved.Introduction 1 Introduction 1.1 Document overview This document describes the features of the family and options available within the family members, and highlights important electrical and physical characteristics of the device. To ensure a complete understanding of the device functionality, refer also to the device reference manual and errata sheet. 1.2 Description The MPC5604B/C is a family of next generation microcontrollers built on the Power Architecture embedded category. The MPC5604B/C family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of body electronics applications within the vehicle. The advanced and cost-efficient host processor core of this automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU, providing improved code density. It operates at speeds of up to 64 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations. MPC5604B/C Microcontroller Data Sheet, Rev. 11.1 2 Freescale Semiconductor