Freescale Semiconductor Document Number: MPC5674F Rev. 10.1, 06/2015 Data Sheet: Advance Information MPC5674F TEPBGA416 TEPBGA516 MPC5674F Microcontroller 27mm x 27mm 27mm x 27mm Data Sheet TEPBGA324 Covers: MPC5674F and MPC5673F 23mm x 23mm Dual issue, 32-bit CPU core complex (e200z7) single action, double action, pulse width modulation Compliant with the Power Architecture embedded (PWM) and modulus counter operation category Four enhanced queued analog-to-digital converters 16 KB I-Cache and 16 KB D-Cache (eQADC) Includes an instruction set enhancement allowing Support for 64 analog channels variable length encoding (VLE), optional encoding of Includes one absolute reference ADC channel mixed 16-bit and 32-bit instructions, for code size Includes eight decimation filters footprint reduction Four deserial serial peripheral interface (DSPI) modules Includes signal processing extension (SPE2) instruction Three enhanced serial communication interface (eSCI) support for digital signal processing (DSP) and modules single-precision floating point operations Four controller area network (FlexCAN) modules 4 MB on-chip flash Dual-channel FlexRay controller Supports read during program and erase operations, and Nexus development interface (NDI) per IEEE-ISTO multiple blocks allowing EEPROM emulation 5001-2003/5001-2008 standard 256 KB on-chip general-purpose SRAM including 32 KB Device and board test support per Joint Test Action Group of standby RAM (JTAG) (IEEE 1149.1) Two direct memory access controller (eDMA2) blocks On-chip voltage regulator controller regulates supply One supporting 64 channels voltage down to 1.2 V for core logic One supporting 32 channels Interrupt controller (INTC) Frequency modulated phase-locked loop (FMPLL) Crossbar switch architecture for concurrent access to peripherals, flash, or RAM from multiple bus masters External bus interface (EBI) for calibration and application development (not available on all packages) System integration unit (SIU) Error correction status module (ECSM) Boot assist module (BAM) supports serial bootload via CAN or SCI Two second-generation enhanced time processor units (eTPU2) that share code and data RAM. 32 standard channels per eTPU2 24 KB code RAM 6 KB parameter (data) RAM Enhanced modular input output system supporting 32 unified channels (eMIOS) with each channel capable of Freescale Semiconductor, Inc., 2008-2015. All rights reserved.Table of Contents 1 Ordering Information .3 4.7.3 LVDS Pad Specifications . 35 1.1 Orderable Parts 3 4.8 Oscillator and FMPLL Electrical Characteristics . 35 1.2 MPC567xF Family Differences 4 4.9 eQADC Electrical Characteristics 37 2 MPC5674F Blocks 5 4.9.1 ADC Internal Resource Measurements 39 2.1 Block Diagram .5 4.10 C90 Flash Memory Electrical Characteristics . 40 3 Pin Assignments 5 4.11 AC Specifications . 42 3.1 324-ball TEPBGA Pin Assignments 6 4.11.1 Clocking 42 3.2 416-ball TEPBGA Pin Assignments 9 4.11.2 Pad AC Specifications . 44 3.3 516-ball TEPBGA Pin Assignments .14 4.12 AC Timing 45 3.4 Signal Properties and Muxing 19 4.12.1 Generic Timing Diagrams . 45 4 Electrical Characteristics 20 4.12.2 Reset and Configuration Pin Timing . 46 4.1 Maximum Ratings .20 4.12.3 IEEE 1149.1 Interface Timing 47 4.2 Thermal Characteristics 21 4.12.4 Nexus Timing 50 4.2.1 General Notes for Specifications at 4.12.5 External Bus Interface (EBI) Timing . 53 Maximum Junction Temperature 23 4.12.6 External Interrupt Timing (IRQ Pin) . 57 4.3 EMI (Electromagnetic Interference) Characteristics .24 4.12.7 eTPU Timing 57 4.4 ESD Characteristics .25 4.12.8 eMIOS Timing . 58 4.5 PMC/POR/LVI Electrical Specifications 25 4.12.9 DSPI Timing . 59 4.6 Power Up/Down Sequencing 29 5 Package Information . 65 4.6.1 Power-Up 29 5.1 324-Pin Package . 66 4.6.2 Power-Down .30 5.2 416-Pin Package . 68 4.6.3 Power Sequencing and POR Dependent on V 5.3 516-Pin Package . 70 DDA 30 6 Product Documentation . 72 4.7 DC Electrical Specifications .30 Appendix ASignal Properties and Muxing 73 4.7.1 I/O Pad Current Specifications .33 Appendix BRevision History . 125 4.7.2 I/O Pad V Current Specifications 34 DD33 MPC5674F Microcontroller Data Sheet, Rev. 10.1 2 Freescale Semiconductor