NXP Semiconductors Document Number: MPC5675K Rev. 8.1, 04/2020 Data Sheet: Technical Data MPC5675K MAPBGA225 QFN12 MPC5675K Microcontroller 15 mm x 15 mm mm x mm Data Sheet SOT-343R PKG-TBD 1 Introduction mm x mm mm x mm TBD 473 MAPBGA 257 MAPBGA (19 x 19 mm) (14 x 14 mm) 1 Introduction . 1 1.1 Document overview 1.1 Document overview 1 1.2 Description . 1 This document provides electrical specifications, pin 1.3 Device comparison . 2 assignments, and package diagrams for the MPC5675K series 1.4 Block diagram . 5 of microcontroller units (MCUs). 1.5 Feature list . 6 1.6 Feature details 7 2 Package pinouts and signal descriptions 17 1.2 Description 2.1 Package pinouts 17 2.2 Pin descriptions 20 The MPC5675K microcontroller, a SafeAssure solution, is a 3 Electrical characteristics . 69 32-bit embedded controller designed for advanced driver 3.1 Introduction 69 assistance systems with RADAR, CMOS imaging, LIDAR 3.2 Absolute maximum ratings 69 3.3 Recommended operating conditions 70 and ultrasonic sensors, and multiple 3-phase motor control 3.4 Thermal characteristics 72 applications as in hybrid electric vehicles (HEV) in 3.5 Electromagnetic interference (EMI) characteristics . 73 automotive and high temperature industrial applications. 3.6 Electrostatic discharge (ESD) characteristics 74 3.7 Static latch-up (LU) 74 A member of NXP Semiconductors MPC5500/5600 family, 3.8 Power Management Controller (PMC) electrical it contains the Book E compliant Power Architecture characteristics . 74 technology core with Variable Length Encoding (VLE). This 3.9 Supply current characteristics . 76 core complies with the Power Architecture embedded 3.10 Temperature sensor electrical characteristics . 77 category, and is 100 percent user mode compatible with the 3.11 Main oscillator electrical characteristics 77 3.12 FMPLL electrical characteristics 78 original Power PC user instruction set architecture (UISA). 3.13 16 MHz RC oscillator electrical characteristics 79 It offers system performance up to four times that of its 3.14 ADC electrical characteristics 80 MPC5561 predecessor, while bringing you the reliability and 3.15 Flash memory electrical characteristics 85 familiarity of the proven Power Architecture technology. 3.16 SRAM memory electrical characteristics . 87 3.17 GP pads specifications . 87 A comprehensive suite of hardware and software 3.18 PDI pads specifications 90 development tools is available to help simplify and speed 3.19 DRAM pad specifications . 93 system design. Development support is available from 3.20 RESET characteristics 100 3.21 Reset sequence . 100 leading tools vendors providing compilers, debuggers and 3.22 Peripheral timing characteristics . 107 simulation development environments. 4 Package characteristics 131 4.1 Package mechanical data 131 5 Orderable parts 137 6 Reference documents . 137 7 Document revision historys . 137 NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Introduction 1.3 Device comparison Table 1. MPC5675K family device comparison Features MPC5673K MPC5674K MPC5675K 1 CPU Type 2 e200z7d (SoR ) in lock-step or decoupled operation Architecture Harvard Execution speed 0150 MHz (+2% FM) 0180 MHz (+2% FM) 0180 MHz (+2% FM) Nominal platform 075 MHz (+2% FM) 090 MHz (+2% FM) 090 MHz (+2% FM) frequency (in 1:1, 1:2, and 1:3 modes) MMU 64 entries (SoR) Instruction set PPC Yes Instruction set VLE Yes Instruction cache 16 KB, 4-way with EDC (SoR) Data cache 16 KB, 4-way with Parity (SoR) MPU Yes (SoR) Buses Core bus 32-bit address, 64-bit data Internal periphery bus 32-bit address, 32-bit data XBAR Master slave ports Yes (SoR) Memory Static RAM (SRAM) 256 KB (ECC) 384 KB (ECC) 512 KB (ECC) 2 2 2 Code flash memory 1 MB (ECC) 1.5 MB (ECC) 2 MB (ECC) 2 Data flash memory 64 KB (ECC) Modules Analog-to-Digital 257 pin pkg: 4 12 bit (22 external channels) Converter (ADC) 473 pin pkg: 4 12 bit (up to 34 external channels) CRC unit 2 (3 contexts each) Cross Triggering Unit 2 modules (CTU) 4 Deserial Serial 2 modules 3 modules 3 Peripheral Interface (3 chip selects) (DSPI) Digital I/Os 16 5 DRAM Controller No Yes (DRAMC) Enhanced Direct 2 modules, 32 channels each Memory Access (eDMA) eTimer 3 modules, 6 channels each MPC5675K Microcontroller Data Sheet, Rev. 8.1 2 NXP Semiconductors