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X-On Electronics has gained recognition as a prominent supplier of SPC5744PGK1AMMM9 32-bit Microcontrollers - MCU across the USA, India, Europe, Australia, and various other global locations. SPC5744PGK1AMMM9 32-bit Microcontrollers - MCU are a product manufactured by NXP. We provide cost-effective solutions for 32-bit Microcontrollers - MCU, ensuring timely deliveries around the world.

SPC5744PGK1AMMM9 NXP

SPC5744PGK1AMMM9 electronic component of NXP
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Part No.SPC5744PGK1AMMM9
Manufacturer: NXP
Category: 32-bit Microcontrollers - MCU
Description: 32-bit Microcontrollers - MCU 2 x e200Z4 cores in LS, 200 MHz, 2.5MB Flash, 384kB SRAM, MAPBGA 257, 1 x FlexRay, 1 x Ethernet, 40 C to +125 C
Datasheet: SPC5744PGK1AMMM9 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 28.677 ea
Line Total: USD 28.68 
Availability - 721
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4
Ship by Mon. 06 Jan to Thu. 09 Jan
MOQ : 1
Multiples : 1
1 : USD 22.4967

721
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ : 1
Multiples : 1
1 : USD 28.677
10 : USD 20.724
100 : USD 20.559
760 : USD 20.548

   
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We are delighted to provide the SPC5744PGK1AMMM9 from our 32-bit Microcontrollers - MCU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SPC5744PGK1AMMM9 and other electronic components in the 32-bit Microcontrollers - MCU category and beyond.

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Document Number MPC5744P NXP Semiconductors Rev. 6.1, 11/2017 Data Sheet: Technical Data MPC5744P MPC5744P Data Sheet 32-bit MCU suitable for ISO26262 ASIL- D chassis and safety applications Features This document provides electrical specifications, pin assignments, and package diagram information for the The MPC5744P microcontroller is based on the Power MPC5744P series of microcontroller units (MCUs). Architecture developed by NXP. It targets chassis For functional characteristics and the programming and safety applications and other applications requiring model, see the MPC5744P Reference Manual. a high Automotive Safety Integrity Level (ASIL). The MPC5744P is a SafeAssure solution. Junction temperature: The upper limit is 150C or 165C depending on the device marking. NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Introduction.......................................................................................... 3 3.12 Main oscillator electrical characteristics................................... 69 1.1 Features......................................................................................3 3.13 PLLDIG electrical characteristics............................................. 72 1.2 Block Diagram...........................................................................5 3.14 16 MHz Internal RC Oscillator (IRCOSC) electrical 2 Pinouts..................................................................................................6 specifications............................................................................. 73 2.1 Package pinouts and ballmap.................................................... 6 3.15 ADC electrical characteristics................................................... 74 2.2 Pin/ball descriptions ................................................................. 8 3.16 Flash memory specifications..................................................... 77 2.2.1 Pin/ball startup and reset states................................. 8 3.16.1 Maximum junction temperature 150C.....................77 2.2.2 Power supply and reference voltage pins/balls......... 9 3.16.2 Maximum junction temperature 165C.....................80 2.2.3 System pins/balls.......................................................12 3.16.3 Flash memory read wait-state and address-pipeline 2.2.4 LVDS pins/balls........................................................13 control settings.......................................................... 84 2.2.5 Generic pins/balls......................................................14 3.17 SGEN electrical characteristics................................................. 85 2.2.6 Peripheral input muxing............................................43 3.18 RESET sequence duration.........................................................86 3 Electrical characteristics.......................................................................55 3.19 AC specifications.......................................................................86 3.1 Introduction............................................................................... 55 3.19.1 Reset pad (EXT POR, RESET) electrical 3.2 165C junction temperature option........................................... 55 characteristics............................................................87 3.3 Absolute maximum ratings....................................................... 55 3.19.2 WKUP/NMI timing...................................................89 3.4 Recommended operating conditions......................................... 57 3.19.3 Debug/JTAG/Nexus/Aurora timing..........................89 3.5 Thermal characteristics..............................................................58 3.19.4 External interrupt timing (IRQ pin).......................... 96 3.5.1 General notes for specifications at maximum 3.19.5 SPI timing................................................................. 97 junction temperature................................................. 59 3.19.6 LFAST...................................................................... 102 3.6 Electromagnetic compatibility (EMC)...................................... 60 3.19.7 FlexRay..................................................................... 106 3.7 Electrostatic discharge (ESD) characteristics............................62 3.19.8 Ethernet switching specifications..............................109 3.8 Voltage regulator electrical characteristics............................... 62 4 Obtaining package dimensions.............................................................111 3.9 DC electrical characteristics......................................................65 5 Ordering information............................................................................112 3.10 Supply current characteristics....................................................67 6 Document revision history................................................................... 113 3.11 Temperature sensor................................................................... 69 MPC5744P Data Sheet, Rev. 6.1, 11/2017 2 NXP Semiconductors

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8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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