Document Number: MPC5775E NXP Semiconductors Rev. 2, 03/2020 Data Sheet: Technical Data MPC5775E MPC5775E/MPC5775B Microcontroller Data Sheet Features For functional characteristics and the programming This document provides electrical specifications, pin model, see the MPC5775E Reference Manual. assignments, and package diagram information for the MPC5775E series of microcontroller units (MCUs). NXP reserves the right to change the proudction detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Introduction...............................................................................3 3.11.1 Power management electrical characteristics..37 1.1 Features summary..........................................................3 3.11.2 Power management integration........................39 1.2 Block diagram..................................................................4 3.11.3 Device voltage monitoring................................41 2 Pinouts......................................................................................5 3.11.4 Power sequencing requirements......................43 2.1 416-ball MAPBGA pin assignments................................5 3.12 Flash memory specifications...........................................44 3 Electrical characteristics............................................................6 3.12.1 Flash memory program and erase 3.1 Absolute maximum ratings..............................................6 specifications....................................................45 3.2 Electromagnetic interference (EMI) characteristics.........8 3.12.2 Flash memory Array Integrity and Margin 3.3 Electrostatic discharge (ESD) characteristics.................8 Read specifications..........................................45 3.4 Operating conditions.......................................................8 3.12.3 Flash memory module life specifications..........46 3.5 DC electrical specifications.............................................11 3.12.4 Data retention vs program/erase cycles...........47 3.6 I/O pad specifications......................................................12 3.12.5 Flash memory AC timing specifications............47 3.6.1 Input pad specifications....................................12 3.12.6 Flash memory read wait-state and address- 3.6.2 Output pad specifications.................................14 pipeline control settings....................................48 3.6.3 I/O pad current specifications...........................17 3.13 AC timing.........................................................................49 3.7 Oscillator and PLL electrical specifications.....................17 3.13.1 Generic timing diagrams...................................49 3.7.1 PLL electrical specifications.............................18 3.13.2 Reset and configuration pin timing...................50 3.7.2 Oscillator electrical specifications.....................19 3.13.3 IEEE 1149.1 interface timing............................51 3.8 Analog-to-Digital Converter (ADC) electrical 3.13.4 Nexus timing.....................................................54 specifications...................................................................21 3.13.5 External interrupt timing (IRQ/NMI pin)............56 3.8.1 Enhanced Queued Analog-to-Digital 3.13.6 eTPU timing......................................................57 Converter (eQADC)..........................................21 3.13.7 eMIOS timing....................................................57 3.8.2 Sigma-Delta ADC (SDADC).............................23 3.13.8 DSPI timing with CMOS and LVDS pads.........58 3.9 Temperature Sensor.......................................................31 3.13.9 FEC timing........................................................70 3.10 LVDS pad electrical characteristics.................................32 4 Package information.................................................................75 3.10.1 MSC/DSPI LVDS interface timing diagrams.....32 4.1 Thermal characteristics...................................................75 3.10.2 MSC/DSPI LVDS interface electrical 4.1.1 General notes for thermal characteristics.........76 characteristics...................................................34 5 Ordering information.................................................................79 3.11 Power management: PMC, POR/LVD, power 6 Document revision history.........................................................79 sequencing......................................................................36 MPC5775E/MPC5775B Microcontroller Data Sheet Data Sheet, Rev. 2, 03/2020. 2 NXP Semiconductors