SPC5777CDK3MME3 NXP

Document Number MPC5777C NXP Semiconductors Rev. 15, 03/2021 Data Sheet: Technical Data MPC5777C MPC5777C Microcontroller Data Sheet Features For functional characteristics and the programming model, see the MPC5777C Reference Manual. This document provides electrical specifications, pin assignments, and package diagram information for the MPC5777C series of microcontroller units (MCUs). NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Introduction.......................................................................................... 3 3.11 Power management: PMC, POR/LVD, power sequencing.......39 1.1 Features summary......................................................................3 3.11.1 Power management electrical characteristics.........39 1.2 Block diagram........................................................................... 4 3.11.2 Power management integration.............................. 42 2 Pinouts..................................................................................................5 3.11.3 Device voltage monitoring..................................... 43 2.1 416-ball MAPBGA pin assignments.........................................5 3.11.4 Power sequencing requirements.............................45 2.2 516-ball MAPBGA pin assignments.........................................6 3.12 Flash memory specifications..................................................... 46 3 Electrical characteristics.......................................................................7 3.12.1 Flash memory program and erase specifications... 47 3.1 Absolute maximum ratings....................................................... 7 3.12.2 Flash memory Array Integrity and Margin Read 3.2 Electromagnetic interference (EMI) characteristics..................9 specifications.......................................................... 47 3.3 Electrostatic discharge (ESD) characteristics............................9 3.12.3 Flash memory module life specifications...............48 3.4 Operating conditions................................................................. 9 3.12.4 Data retention vs program/erase cycles..................49 3.5 DC electrical specifications.......................................................12 3.12.5 Flash memory AC timing specifications................ 49 3.6 I/O pad specifications................................................................13 3.12.6 Flash memory read wait-state and address- 3.6.1 Input pad specifications..........................................13 pipeline control settings..........................................50 3.6.2 Output pad specifications....................................... 15 3.13 AC timing.................................................................................. 51 3.6.3 I/O pad current specifications.................................18 3.13.1 Generic timing diagrams........................................ 51 3.7 Oscillator and PLL electrical specifications..............................19 3.13.2 Reset and configuration pin timing........................ 51 3.7.1 PLL electrical specifications.................................. 20 3.13.3 IEEE 1149.1 interface timing.................................52 3.7.2 Oscillator electrical specifications..........................21 3.13.4 Nexus timing.......................................................... 55 3.8 Analog-to-Digital Converter (ADC) electrical specifications...23 3.13.5 External Bus Interface (EBI) timing...................... 57 3.8.1 Enhanced Queued Analog-to-Digital Converter 3.13.6 External interrupt timing (IRQ/NMI pin)...............61 (eQADC)................................................................ 23 3.13.7 eTPU timing........................................................... 62 3.8.2 Sigma-Delta ADC (SDADC)................................. 25 3.13.8 eMIOS timing.........................................................63 3.9 Temperature Sensor...................................................................32 3.13.9 DSPI timing with CMOS and LVDS pads.............64 3.10 LVDS Fast Asynchronous Serial Transmission (LFAST) pad 3.13.10 FEC timing............................................................. 77 electrical characteristics.............................................................33 4 Package information.............................................................................81 3.10.1 LFAST interface timing diagrams..........................33 4.1 Thermal characteristics..............................................................81 3.10.2 LFAST and MSC/DSPI LVDS interface electrical 4.1.1 General notes for thermal characteristics............... 82 characteristics......................................................... 35 5 Ordering information............................................................................85 3.10.3 LFAST PLL electrical characteristics.................... 38 6 Document revision history................................................................... 86 MPC5777C Microcontroller Data Sheet, Rev. 15, 03/2021 2 NXP Semiconductors