TEA1755LT HV start-up DCM/QR flyback controller with integrated DCM/QR PFC controller Rev. 1.1 13 March 2015 Product data sheet 1. General description The GreenChip is the latest generation of green Switched Mode Power Supply (SMPS) controller ICs. The TEA1755LT combines a controller for Power Factor Correction (PFC) and a flyback controller. Its high level of integration enables cost-effective power supply design using a very low number of external components. The PFC operates in Quasi-Resonant (QR) or Discontinuous Conduction Mode (DCM), with valley switching. The specially built-in green functions provide high efficiency at all power levels. At high power levels the flyback operates in QR mode or DCM with valley detection. At medium power levels, the flyback controller switches to Frequency Reduction (FR) mode and limits the peak current to an adjustable minimum value. In low power mode, the PFC switches off to maintain high efficiency. At very low power levels, when the flyback switching frequency drops below 25 kHz, the flyback converter switches to burst mode. During the non-switching phase of burst mode, the internal IC supply current is minimized to further optimize efficiency. Valley switching is used in all operating modes. The advanced burst mode ensures high efficiency at low power and good standby power performance while minimizing audible transformer noise. The TEA1755LT is a Multi-Chip Module, (MCM), containing two chips. The proprietary high-voltage BCD800 process makes direct start-up possible from the rectified universal mains voltage in an effective and green way. The second low voltage Silicon-On-Insulator (SOI) is used for accurate, high-speed protection functions and control. The TEA1755LT enables easy design of highly efficient and reliable supplies up to 250 W. These power supply designs are cost-effective, requiring the minimum number of external components. Remark: All values in this document are typical values unless otherwise stated.TEA1755LT NXP Semiconductors HV start-up DCM/QR flyback controller with integrated DCM/QR PFC controller 2. Features and benefits 2.1 Distinctive features Integrated PFC and flyback controller Universal mains supply operation between 70 V (AC) to 276 V (AC) Dual-boost PFC with accurate maximum output voltage (NXP Semiconductors patented) High level of integration, results in cost-effective designs with very low external component counts Adjustable PFC switch off delay External PFC switch on and switch off override Accurate PFC switch on and switch off control (NXP Semiconductors patent pending) 2.2 Green features On-chip start-up current source Reduced IC supply current during burst mode enabling ErP lot 6 Power-down functionality for very low standby power 2.3 PFC green features Valley/Zero-Voltage Switching (ZVS) for minimum switching losses (NXP Semiconductors patented) Frequency limitation reduces switching losses PFC switched off when a low-load is detected at the flyback output 2.4 Flyback green features Valley switching for minimum switching losses (NXP Semiconductors patented) Frequency reduction with adjustable minimum peak current at low-power operation maintains high-efficiency at low output power levels Burst mode operation at very low-power levels for high-efficiency operation 2.5 Protection features Safe restart mode for system fault conditions Continuous mode protection using demagnetization detection for both converters (NXP Semiconductors patented) UnderVoltage Protection (UVP) (foldback during overload) Accurate OverVoltage Protection (OVP) for both converters (adjustable for flyback converter) Mains voltage independent OverPower Protection (OPP) Open control loop protection for both converters. The open-loop protection on the flyback converter is latched OverTemperature Protection (OTP) Low and adjustable OverCurrent Protection (OCP) trip level for both converters General-purpose input for latched protection, for use with system OverTemperature Protection (OTP) TEA1755LT All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 1.1 13 March 2015 2 of 35