X-On Electronics has gained recognition as a prominent supplier of TWR-KL82Z72M Development Boards & Kits - ARM across the USA, India, Europe, Australia, and various other global locations. TWR-KL82Z72M Development Boards & Kits - ARM are a product manufactured by NXP. We provide cost-effective solutions for Development Boards & Kits - ARM, ensuring timely deliveries around the world.

TWR-KL82Z72M NXP

TWR-KL82Z72M electronic component of NXP
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Part No.TWR-KL82Z72M
Manufacturer: NXP
Category: Development Boards & Kits - ARM
Description: Development Boards & Kits - ARM A Tower System Development platform for Kinetis-M family microcontroller - TWR-KL82Z72M
Datasheet: TWR-KL82Z72M Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 254.3358 ea
Line Total: USD 254.34 
Availability - 1
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1
Ship by Thu. 21 Nov to Mon. 25 Nov
MOQ : 1
Multiples : 1
1 : USD 254.3358

   
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NXP Semiconductors Document Number: KL82P121M72SF0 Data Sheet: Technical Data Rev. 4, 12/2016 Kinetis KL82 Microcontroller MKL82Z128Vxx7(R) 72 MHz ARM Cortex-M0+ with 128 KB Flash and 96 KB SRAM The KL82 MCU family s high performance, encryption features and ultra-low power capabilities extend its reach beyond traditional mPOS pin pads and terminals into more power- restricted payment applications, such as smartphone and tablet 100 & 80 & 64 LQFP attach readers, as well as those embedded in wearable 121 & 64 MAPBGA (LL&LK&LH) technology. (MC&MP) 14x14 x1.7 mm Pitch 8x8x1.43 mm Pitch 0.5mm 12x12x1.6 mm 0.65 mm 5x5x1.23 mm Pitch 0.5 mm The product offers: Pitch 0.5 mm 10x10x1.6 mm Pitch Hardware asymmetric cryptography high-speed, code- 0.5 mm and power-efficient data authentication with support for latest encryption protocols EMV-compatible with ISO7816-3 SIM interfaces architected for EMV compliance and supported by an EMV Level 1 software stack QSPI interface to expand program memory Sleep mode power consumption from 2.5 A with the SRAM content retained and RTC enabled Crystal-less USB OTG controller, 16-bit ADC and multiple serial communication interfaces can all function autonomously in low-power modes with minimal CPU intervention FlexIO to support any standard and customized serial peripheral emulation Core Processor Peripherals 72 MHz ARM Cortex-M0+ core ( up to 96 MHz for high- USB full-speed 2.0 OTG controller supporting speed run) crystal-less operation and keeping connection alive under ultra-low power Memories Three low-power UART modules supporting 128 KB program flash memory asynchronous operation in low-power modes 96 KB SRAM Two I2C modules supporting up to 1 Mbps 32 KB ROM with built-in boot loader Two 16-bit SPI modules supporting up to 32 B backup register 24Mbps QSPI to expand program code in external high-speed serial One FlexIO module supporting emulation of NOR flash memory additional UART, SPI, I2C, I2S, PWM and other serial modules, etc. up to 32 channels System One 16-bit ADC module with high accurate 8-channel asynchronous enhanced DMA controller internal voltage reference and up to 16 Watchdog channels Low-leakage wakeup unit High-speed analog comparator containing a 6- Two-pin serial wire debug (SWD) programming and bit DAC for programmable reference input debugging interface One 12-bit DAC module Micro trace buffer Two EMVSIM modules supporting EMV L1 Bit manipulation engine compatible interface Interrupt controller Touch sensing interface up to 16 channels NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. Memory protection unit I/O SRAM bit-banding Up to 85 General-purpose input/output pins (GPIO) Clocks 48 MHz high accuracy (up to 0.5%) internal reference clock Operating Characteristics for high-speed run Voltage range: 1.71 to 3.6 V 4 MHz high accuracy (up to 2%) internal reference clock for Flash write voltage range: 1.71 to 3.6 V low-speed run Temperature range (ambient): -40 to 105C 32 kHz internal reference clock Low Power 1 kHz internal reference clock Down to 125 A/MHz in Run mode 3240 kHz and 332 MHz crystal oscillator Down to 272 nA in Stop mode (RAM and RTC PLL/FLL retained) Timers Six flexible static modes One 6-channel Timer/PWM module Packages Two 2-channel Timer/PWM modules 121 MAPBGA 8mm x 8mm, 0.65mm pitch, Two low-power timers 1.43mm max thickness 4-channel periodic interrupt timer 80 LQFP 12mm x 12mm, 0.5mm pitch, 1.6mm Independent real time clock max thickness Security 100 LQFP 14mm x 14mm, 0.5mm pitch, 128-bit unique identification number per chip 1.7mm max thickness (Package Your Way) Advanced flash security and access control 64 MAPBGA 5mm x 5mm, 0.5mm pitch, Hardware CRC module 1.23mm max thickness (Package Your Way) Low-power trusted crypto engine supporting AES128/256, 64 LQFP 10mm x 10mm, 0.5mm pitch, 1.6mm DES, 3DES, SHA256, RSA and ECC, with hardware DPA max thickness (Package Your Way) True random number generator NOTE The 100-, 64-pin LQFP and 64-pin MAPBGA packages supporting MKL82Z128VLL7, MKL82Z128VLH7 and MKL82Z128VMP7 part numbers for this product are not yet available. However, these packages are included in Package Your Way program for Kinetis MCUs. Visit nxp.com/KPYW for more details. Related resources Type Description Resource Selector Guide The NXP Solution Advisor is a web-based tool that features Solution Advisor interactive application wizards and a dynamic product selector. 1 Reference The Reference Manual contains a comprehensive description of the KL82P121M72SF0RM Manual structure and function (operation) of a device. 1 Data Sheet The Data Sheet includes electrical characteristics and signal KL82P121M72SF0 connections. 2 Chip Errata The chip mask set Errata provides additional or corrective information xN51R for a particular device mask set. Package Package dimensions are provided in package drawings. MAPBGA 121-pin: 98ASA00423D drawing MAPBGA 64-pin: 98ASA00420D LQFP 100-pin: 98ASS23308W LQFP 80-pin: 98ASS23174W LQFP 64-pin: 98ASS23234W 1. To find the associated resource, go to

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8543.70.00 Other machines and apparatus Free
13 Signal processors (graphic equalisers, crossovers etc.) 91 Other Free

9027.10.00 Instruments and apparatus for physical or chemical analysis (eg, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes Free

9031.80.00 MEASURING OR CHECKING INSTRUMENTS, APPLIANCES AND MACHINES, NOT SPECIFIED OR INCLUDED ELSEWHERE IN THIS CHAPTER; PROFILE PROJECTORS Other instruments, appliances and machines Free

9030.31.00 Oscilloscopes, spectrum analysers and other instruments and apparatus for measuring or checking electrical quantities, excluding meters of 9028; instruments and apparatus for measuring or detecting alpha, beta, gamma, x-ray, cosmic or other ionising radiations.
Other instruments and apparatus, for measuring or checking voltage, current, resistance or power Multimeters without a recording device Free

8473.30.00 Parts and accessories of the machines of 8471 AUTOMATIC DATA PROCESSING MACHINES AND UNITS THEREOF; MAGNETIC OR OPTICAL READERS, MACHINES FOR TRANSCRIBING DATA ONTO DATA MEDIA IN CODED FORM AND MACHINES FOR PROCESSING SUCH DATA, NOT ELSEWHERE SPECIFIED OR INCLUDED:
.Other 71 No Weighing less than 1kg Free

8537 BOARDS, PANELS, CONSOLES, DESKS, CABINETS AND OTHER BASES, EQUIPPED WITH TWO OR MORE APPARATUS OF 8535 OR 8536, FOR ELECTRIC CONTROL OR THE DISTRIBUTION OF ELECTRICITY, INCLUDING THOSE INCORPORATING INSTRUMENTS OR APPARATUS OF CHAPTER 90, AND NUMERICAL CONTROL APPARATUS, OTHER THAN SWITCHING APPARATUS OF 8517:
8538 PARTS SUITABLE FOR USE SOLELY OR PRINCIPALLY WITH THE APPARATUS OF 8535, 8536 OR 8537:
8538.10.10 22 For programmable controllers Free
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NXP
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